公开(公告)号：US20170260639A1

公开(公告)日：2017-09-14

申请号：US15452062

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Yogita PAREEK ,  Laksheswar KALITA ,  Geetika BAJAJ ,  Kevin A. PAPKE ,  Ankur KADAM ,  Bipin THAKUR ,  Yixing LIN ,  Dmitry LUBOMIRSKY ,  Prerna A. GORADIA

IPC: C25D3/44 ,  C25D5/50 ,  H01L21/67 ,  C25D5/18

CPC classification number: C25D3/44 ,  C25D3/66 ,  C25D5/022 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D11/04 ,  H01L21/67023

Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.

公开(公告)号：US20160258064A1

公开(公告)日：2016-09-08

申请号：US14705659

申请日：2015-05-06

Applicant: Applied Materials, Inc.

Inventor： Yogita PAREEK ,  Ankur KADAM ,  Laksheswar KALITA ,  Bipin THAKUR ,  Dmitry LUBOMIRSKY

IPC: C23C16/50 ,  C25D11/08 ,  C25D11/10

CPC classification number: C23C16/50 ,  C23C14/564 ,  C23C16/4404 ,  C23C16/4581 ,  C25D11/06 ,  C25D11/08 ,  C25D11/10

Abstract: The disclosure relates to a chamber component or a method for fabricating a chamber component for use in a plasma processing chamber apparatus. In one embodiment, a chamber component, for use in a plasma processing apparatus, includes an aluminum body having an anodized coating disposed on the aluminum body formed from a neutral electrolyte solution, wherein the anodized coating has a film density higher than 3.1 g/cm−2.

Abstract translation: 本发明涉及室等离子体处理室装置中使用的腔室部件或制造室部件的方法。 在一个实施例中，用于等离子体处理装置的腔室部件包括铝本体，其具有设置在由中性电解质溶液形成的铝体上的阳极氧化涂层，其中阳极氧化涂层的膜密度高于3.1g / cm -2。

公开(公告)号：US20180163317A1

公开(公告)日：2018-06-14

申请号：US15835067

申请日：2017-12-07

Applicant: Applied Materials, Inc.

Inventor： Balaji GANAPATHY ,  Ankur KADAM ,  Prerna S. GORADIA ,  Laksheswar KALITA ,  Tapash CHAKRABORTY ,  Vijay Bhan SHARMA

IPC: C25D5/44 ,  C25D3/44 ,  C25D5/18 ,  C25D7/00

CPC classification number: C25D5/44 ,  C25D3/44 ,  C25D5/022 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D7/00 ,  C25D9/08 ,  C25D11/04

Abstract: In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.

公开(公告)号：US20170260618A1

公开(公告)日：2017-09-14

申请号：US15451995

申请日：2017-03-07

Applicant: Applied Materials, Inc.

Inventor： Laksheswar KALITA ,  Prerna A. GORADIA ,  Geetika BAJAJ ,  Yogita PAREEK ,  Yixing LIN ,  Dmitry LUBOMIRSKY ,  Ankur KADAM ,  Bipin THAKUR ,  Kevin A. PAPKE ,  Kaushik VAIDYA

IPC: C23C8/12 ,  C22F1/16 ,  C23C8/16 ,  C25D3/54 ,  C25D5/50

CPC classification number: C23C8/12 ,  C22F1/16 ,  C23C8/02 ,  C23C8/16 ,  C25D3/54 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D11/08 ,  C25D11/34

Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.