公开(公告)号：US20180163317A1

公开(公告)日：2018-06-14

申请号：US15835067

申请日：2017-12-07

Applicant: Applied Materials, Inc.

Inventor： Balaji GANAPATHY ,  Ankur KADAM ,  Prerna S. GORADIA ,  Laksheswar KALITA ,  Tapash CHAKRABORTY ,  Vijay Bhan SHARMA

IPC: C25D5/44 ,  C25D3/44 ,  C25D5/18 ,  C25D7/00

CPC classification number: C25D5/44 ,  C25D3/44 ,  C25D5/022 ,  C25D5/18 ,  C25D5/48 ,  C25D5/50 ,  C25D7/00 ,  C25D9/08 ,  C25D11/04

Abstract: In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.