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公开(公告)号：US11817383B2
公开(公告)日：2023-11-14
申请号：US17685630
申请日：2022-03-03
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
IPC: H01L23/498 , G01K13/20 , G01K1/08 , G01K7/02 , G01K7/16 , H01L23/00 , H01L23/28 , H01L23/538
CPC classification number: H01L23/4985 , G01K1/08 , G01K7/02 , G01K7/16 , G01K13/20 , H01L23/00 , H01L23/28 , H01L23/538
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20230213715A1
公开(公告)日：2023-07-06
申请号：US17646784
申请日：2022-01-03
Applicant: Apple Inc.
Inventor： Scott D. Morrison , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Manoj Vadeentavida
CPC classification number: G02B6/428 , G02B6/0028 , G02B6/0081 , G02B6/4283 , G02B6/0065
Abstract: Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.
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公开(公告)号：US20230386865A1
公开(公告)日：2023-11-30
申请号：US18316962
申请日：2023-05-12
Applicant: Apple Inc.
Inventor： Kishore N. Renjan , Bilal Mohamed Ibrahim Kani , Kyusang Kim , Manoj Vadeentavida , Pierpaolo Lupo , Prashanth S. Holenarsipur , Praveesh Chandran , Vinodh Babu , Yuta Kuboyama
IPC: H01L21/56 , H01L23/00 , H01L23/538 , H01L23/498 , H01L23/31 , H01L25/065
CPC classification number: H01L21/565 , H01L24/13 , H01L21/568 , H01L23/5389 , H01L23/5383 , H01L23/49827 , H01L23/49811 , H01L23/3121 , H01L24/97 , H01L21/561 , H01L25/0655 , H01L24/16 , H01L24/48 , H01L2224/13099 , H01L2224/02373 , H01L2224/04105 , H01L2224/12105 , H01L2224/02372 , H01L2224/48135
Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.
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公开(公告)号：US20230189445A1
公开(公告)日：2023-06-15
申请号：US18164180
申请日：2023-02-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/189 , H05K1/0298 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20230078536A1
公开(公告)日：2023-03-16
申请号：US17832346
申请日：2022-06-03
Applicant: Apple Inc.
Inventor： Ali N. Ergun , Bilal Mohamed Ibrahim Kani , Chang Liu , Ethan L. Huwe , Jeffrey J. Terlizzi , Jerzy S. Guterman , Jue Wang , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Mandar S. Painaik , Manoj Vadeentavida , Sarah B. Gysbers , Takayoshi Katahira , Zhiqi Wang
Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.
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Patent Agency Ranking
公开(公告)号：US20230056922A1
公开(公告)日：2023-02-23
申请号：US17806412
申请日：2022-06-10
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
IPC: H01L25/16 , H01L23/498 , H01R12/79 , H01R13/6581 , H01L23/31 , H01R12/62 , H01L21/56 , H01R43/20 , H01R12/59 , G01D11/24
Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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公开(公告)号：US20220270955A1
公开(公告)日：2022-08-25
申请号：US17685630
申请日：2022-03-03
Applicant: Apple Inc.
Inventor： Pierpaolo Lupo , Bilal Mohamed Ibrahim Kani , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida
IPC: H01L23/498 , G01K13/20 , G01K1/08 , G01K7/02 , G01K7/16 , H01L23/00 , H01L23/28 , H01L23/538
Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.
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公开(公告)号：US20210337671A1
公开(公告)日：2021-10-28
申请号：US17212983
申请日：2021-03-25
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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公开(公告)号：US20250106995A1
公开(公告)日：2025-03-27
申请号：US18581357
申请日：2024-02-19
Applicant: Apple Inc.
Inventor： Parin R Dedhia , Andrew N Leopold , Bilal Mohamed Ibrahim Kani , Henry H Yang , Jun Zhang , Kishore N Renjan , Manoj Vadeentavida , Takayoshi Katahira
Abstract: Electronic devices and methods include a first electronic device that includes a printed circuit board and a quad plug connector coupled to a first surface of a printed circuit board. A first set of wires is coupled to a second surface of the printed circuit board, and the first set of wires are parallel to each other and are located on a first plane. A second set of wires is coupled to the second surface of the printed circuit board. The second set of wires are parallel to each other and are located on a second plane. The first and second planes are each parallel to each other and to the second surface of the printed circuit board. Moreover, the first set of wires is vertically above the second set of wires.
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公开(公告)号：US12028982B2
公开(公告)日：2024-07-02
申请号：US18480303
申请日：2023-10-03
Applicant: Apple Inc.
Inventor： Bilal Mohamed Ibrahim Kani , Benjamin J. Grena , Kyusang Kim , David M. Kindlon , Pierpaolo Lupo , Kishore N. Renjan , Manoj Vadeentavida
CPC classification number: H05K1/186 , H05K1/0298 , H05K1/189 , H05K1/0274 , H05K2201/10083 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10159
Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
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