公开(公告)号：US20240097723A1

公开(公告)日：2024-03-21

申请号：US18079531

申请日：2022-12-12

Applicant: Apple Inc.

Inventor： David A. Karol ,  Austin J. Luan ,  Ayewin Oung ,  Daniel J. Morizio ,  Jeremy L. Bregman ,  Sean M. Gordoni ,  Vijay Kumar Ramamurthi ,  Wei Ren

IPC: H04B1/04 ,  H04B1/00

CPC classification number: H04B1/0475 ,  H04B1/0053

Abstract: Embodiments disclosed herein determine when a sensor of an electronic device is being used, determine if a transmitter of the electronic device is transmitting a signal, determine whether the signal has a frequency in the certain frequency bands (e.g., that cause noise at the sensor), and reduce power (e.g., perform a power back-off operation) at the transmitter if so.

公开(公告)号：US20240080967A1

公开(公告)日：2024-03-07

申请号：US18160831

申请日：2023-01-27

Applicant: Apple Inc.

Inventor： David A. Karol ,  Zhong J. Ma ,  Sean M. Gordoni ,  Daniel J. Morizio

IPC: H05K1/02 ,  H01Q1/12 ,  H05K1/11

CPC classification number: H05K1/0243 ,  H01Q1/12 ,  H05K1/115 ,  H05K2201/10098 ,  H05K2201/10734

Abstract: An assembly is provided that includes a printed circuit board, a transceiver integrated circuit mounted on a first surface of the printed circuit board, and an antenna module having multiple antennas and that is mounted on a second surface of the printed circuit board. The antenna module at least partially overlaps with the transceiver integrated circuit in an overlap region. The antenna module is electrically coupled to the transceiver integrated circuit via direct passthrough signal connections that extend from the first surface to the second surface. The direct passthrough signal connections are located within the overlap region. Each of the direct passthrough signal connections can be implemented using through-board stacked via structures. The antenna module can include multiple layers of signal routing lines for distributing the signals from the direct passthrough signal connections to the various antennas on the antenna module.

公开(公告)号：US11838432B2

公开(公告)日：2023-12-05

申请号：US17068619

申请日：2020-10-12

Applicant: Apple Inc.

Inventor： Bryan D. Keen ,  Devon A. Monaco ,  Sherry Lee ,  Ihtesham H. Chowdhury ,  Eric N. Nyland ,  Matthew D. Hill ,  Arun R. Varma ,  Lucy E. Browning ,  Sawyer I. Cohen ,  Benjamin J. Pope ,  Abhishek Choudhury ,  James W. Bilanski ,  Yaodong Wang ,  Daniel J. Morizio ,  Nicholas W. Ruhter ,  David A. Karol ,  Sean M. Gordoni

IPC: H05K1/18 ,  H04M1/02 ,  H05K1/11 ,  H05K5/00 ,  G06F1/16 ,  H05K5/02

CPC classification number: H04M1/0206 ,  G06F1/1637 ,  G06F1/1686 ,  H04M1/026 ,  H04M1/0264 ,  H04M1/0266 ,  H05K1/115 ,  H05K1/118 ,  H05K1/189 ,  H05K5/0047 ,  H05K5/0086 ,  H05K5/0217 ,  H04M2201/38

Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.