Protecting anodized surfaces during manufacturing processes

    公开(公告)号:US10443145B2

    公开(公告)日:2019-10-15

    申请号:US15686026

    申请日:2017-08-24

    Applicant: Apple Inc.

    Abstract: Treatments for anodic coatings that provide improved resistance to staining and cracking during various manufacturing processes are described. According to some embodiments, the methods include placing the anodic coatings in partially sealed states by sealing only the outermost portions of the anodic coatings, which protect the outer surfaces of the anodic coatings from contamination and staining. Inner portions of the anodic coatings are left unsealed, thereby making the anodic coatings more compliant and resistant to cracking when exposed to manufacturing processes, even those that involve exposure to high temperatures or high mechanical stress. Subsequent to the processing, another sealing process can be implemented to fully seal the anodic coatings so that they provide good corrosion and wear resistance.

    ANODIZED PART HAVING A MATTE BLACK APPEARANCE

    公开(公告)号:US20200383224A1

    公开(公告)日:2020-12-03

    申请号:US16866248

    申请日:2020-05-04

    Applicant: Apple Inc.

    Abstract: This application relates to an anodized part. The anodized part includes a metal substrate and an anodized layer overlaying and formed from the metal substrate. The anodized layer includes (i) an external surface that includes randomly distributed light-absorbing features that are capable of absorbing visible light incident upon the external surface, and (ii) pores defined by pore walls, where color particles are infused within the pores. The anodized layer is characterized as having a color having an L* value using a CIE L*a*b* color space that is less than 10.

    Process for enhanced corrosion protection of anodized aluminum

    公开(公告)号:US10174436B2

    公开(公告)日:2019-01-08

    申请号:US15092563

    申请日:2016-04-06

    Applicant: Apple Inc.

    Abstract: Processes for enhancing the corrosion resistance of anodized substrates are disclosed. In some embodiments, the process involves a second anodizing operation that targets an area of the substrate that is left inadequately protected by a first anodizing operation, and also targets defects that may have been arisen from intermediate processing operations such as laser-marking operations. The second anodizing operation can be conducted in a non-pore-forming electrolyte, and grows a thick protective barrier film over inadequately protected areas of the substrate, such as laser-marking treated areas.

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