公开(公告)号：US10241418B2

公开(公告)日：2019-03-26

申请号：US15527645

申请日：2015-09-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Marc Hauptmann ,  Dylan John David Davies ,  Paul Janssen ,  Naoko Tsugama ,  Richard Joseph Bruls ,  Kornelis Tijmen Hoekerd ,  Edwin Johannes Maria Janssen ,  Petrus Johannes Van Den Oever ,  Ronald Van Der Wilk ,  Antonius Hubertus Van Schijndel ,  Jorge Alberto Vieyra Salas

IPC: G03B27/52 ,  G03B27/42 ,  G03F7/20 ,  G03F1/84 ,  G01N21/95 ,  H01L21/66 ,  G01N21/956 ,  G01N27/61

Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.

公开(公告)号：US20190219929A1

公开(公告)日：2019-07-18

申请号：US16362754

申请日：2019-03-25

Applicant: ASML NETHERLANDS B.V.

Inventor： Marc Hauptmann ,  Dylan John David Davies ,  Paul Janssen ,  Naoko Tsugama ,  Richard Joseph Bruls ,  Kornelis Tijmen Hoekerd ,  Edwin Johannes Maria Janssen ,  Petrus Johannes Van Den Oever ,  Ronald Van Der Wilk ,  Antonius Hubertus Van Schijndel ,  Jorge Alberto Vieyra Salas

IPC: G03F7/20 ,  G03F1/84 ,  G01N21/95

CPC classification number: G03F7/70616 ,  G01N21/9501 ,  G01N27/61 ,  G01N2021/95676 ,  G03F1/84 ,  G03F7/70508 ,  G03F7/70783 ,  H01L22/12 ,  H01L22/20

Abstract: A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high- resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.

公开(公告)号：US20240274457A1

公开(公告)日：2024-08-15

申请号：US18569484

申请日：2022-06-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Nicholas Alan Allsop ,  Benedikt Schmidt ,  Constans Mathias Weber ,  Till Warming ,  Jianqiang Zhu ,  Milad Mokhtari ,  Antonius Hubertus Van Schijndel

IPC: H01L21/683 ,  B25B11/00

CPC classification number: H01L21/6833 ,  B25B11/00 ,  H01L21/6838

Abstract: A holding device (100) for holding a structural part, in particular a semiconductor wafer (1) or a lithography mask, comprises a base body (10), which is formed from at least one board (11) with an upper side, and a plurality of protruding studs (12), which are arranged on the upper side of the board (11) and form a contact surface (13) with a predetermined flatness for contacting the structural part, wherein on the upper side of the board (11) a notch absorption layer (21) is provided, which has such a low volume density that the notch absorption layer (21) can be compressed by a compaction in the layer volume in the case of mechanical actions by foreign particles (2), without compromising the flatness of the contact surface (13). A method for manufacturing a holding device (100) for holding a structural part is also described.