公开(公告)号：US20040245893A1

公开(公告)日：2004-12-09

申请号：US10454418

申请日：2003-06-03

Applicant: ASM Assembly Automation Ltd.

Inventor： Hing Leung Marchy Li ,  Kin Yik Hung ,  Ming Wai Kelvin Ng

IPC: H02N002/00

CPC classification number: H01L24/85 ,  B06B3/00 ,  B23K20/106 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/78313 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/3011 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.

Abstract translation: 本发明提供了一种用于接合装置的超声换能器组件，包括安装到固定在第一和第二超声发生装置之间的放大喇叭的接合工具。 还提供了一种形成用于接合装置的换能器的方法，包括以下步骤：提供放大喇叭，将第一和第二超声发生装置固定到放大喇叭，使得放大喇叭位于所述第一和第二超声波产生 将接合工具装配并安装到放大喇叭。

公开(公告)号：US20040003891A1

公开(公告)日：2004-01-08

申请号：US10189883

申请日：2002-07-02

Applicant: ASM Assembly Automation Ltd.

Inventor： Chi Wah Cheng ,  Kin Yik Hung ,  Ping Chun (Benson) Chong ,  See Lok Chan

IPC: B32B031/00

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H05K3/3436 ,  H05K3/3489 ,  Y10T156/1089 ,  Y10T156/1707 ,  Y10T156/1798

Abstract: The invention provides an apparatus and method for the application of adhesive substances to objects, such as solder balls, for the purpose of mounting them onto substrates. The apparatus comprises an applicator having a layer of the adhesive substance and a pick carrier to carry objects and move the objects from a supply source to a substrate for mounting the objects thereon. The applicator is located so that the applicator applies the adhesive substance to the objects while the objects carried on the pick carrier are moving between the supply source and the substrate.

Abstract translation: 本发明提供了一种用于将粘合剂物质应用于诸如焊球的物体的装置和方法，用于将它们安装到基底上。 该装置包括具有粘合剂物质层的拾取器和用于携带物体并将物体从供应源移动到基板以将物体安装在其上的拾取托架。 涂抹器的位置使得涂抹器将粘合剂施加到物体上，同时携带在拾取载体上的物体在供给源和基底之间移动。