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    Connectible component identification
    2.
    发明授权
    Connectible component identification 有权

    公开(公告)号：US12175855B2

    公开(公告)日：2024-12-24

    申请号：US18227538

    申请日：2023-07-28

    Applicant: Apple Inc.

    Inventor： Erik G. de Jong ,  Fletcher R. Rothkopf ,  Trevor J. Ness

    IPC: G08B5/22 ,  A45C11/00 ,  G06F1/16 ,  G06K7/14 ,  H04M1/04

    Abstract: A connectible component is connected to a housing. A sensor of the housing is utilized to detect an identity element of the at connectible component. The connectible component is identified utilizing the at least one sensor. In some implementations, identification of the connectible component may identify whether or not a connectible component is connected to the housing. In other implementations, identification of the connectible component may identify the type of connectible component that is connected. In such implementations, the housing may house an electronic device and the electronic device may be configured based on the type of connectible component that is connected.

    ELECTRONIC DEVICE HAVING SEALED BUTTON BIOMETRIC SENSING SYSTEM
    4.
    发明申请
    ELECTRONIC DEVICE HAVING SEALED BUTTON BIOMETRIC SENSING SYSTEM 有权

    公开(公告)号：US20220300041A1

    公开(公告)日：2022-09-22

    申请号：US17805835

    申请日：2022-06-07

    Applicant: Apple Inc.

    Inventor： Tyler S. Bushnell ,  James G. Horiuchi ,  Michael K. McCord ,  Trevor J. Ness

    IPC: G06F1/16 ,  G06F3/044 ,  G06F3/0354 ,  G04B3/00 ,  G06V40/12 ,  G04G21/08 ,  G06V40/13 ,  G06F3/02

    Abstract: A biometric button assembly may be disposed in an opening of an enclosure of an electronic device. The biometric button assembly may include an input member that forms an exterior surface of the button housing and is configured to receive inputs, for example from a user of the electronic device. The biometric button assembly may further include a biometric sensor for detecting the received inputs and transmitting a signal to a processor of the electronic device. The signal may correspond to a biometric characteristic, such as a fingerprint. A flexible conduit may transmit the signal to the processor. A portion of the flexible conduit and a seal may be positioned between the button assembly and the enclosure that prevents contaminants from entering the button housing and the enclosure.

    Adjustable electronic device system with facial mapping
    6.
    发明授权
    Adjustable electronic device system with facial mapping 有权

    公开(公告)号：US11150474B2

    公开(公告)日：2021-10-19

    申请号：US17021942

    申请日：2020-09-15

    Applicant: Apple Inc.

    Inventor： Jeremy C. Franklin ,  Trevor J. Ness

    IPC: G02B27/01 ,  G02B27/00 ,  G06K9/00

    Abstract: A head-mounted device may have a display for displaying image content. Head-mounted support structures in the device may be used to support the display. The head-mounted device or external equipment may include a three-dimensional image sensor. The three-dimensional image sensor may capture a three-dimensional image of a user's face. Control circuitry may analyze the three-dimensional image to identify which of multiple versions of a customizing face-fit module should be used in the electronic device to fit the device to the user's face. An appropriate face-fit module may be identified based on facial features such as facial size and the shapes of a user's forehead, nose, and cheeks. After identifying which version of the face-fit module is to be used by the user, that version of the face-fit module may be coupled to a non-custom portion of a main unit for the head-mounted device using magnets or other coupling structures.

    CO-FINISHING SURFACES
    10.
    发明申请
    CO-FINISHING SURFACES 审中-公开
    复合表面

    公开(公告)号：US20160256979A1

    公开(公告)日：2016-09-08

    申请号：US14714876

    申请日：2015-05-18

    Applicant: Apple Inc.

    Inventor： Naoto Matsuyuki ,  Bin Yi ,  Dezheng Qu ,  Jairam Manjunathaiah ,  Scott M. Nathanson ,  Trevor J. Ness ,  David I. Nazzaro ,  Raul A. Molina

    IPC: B24B37/04 ,  B29C70/88 ,  B29C65/50 ,  C03C25/00 ,  B29C70/74

    CPC classification number: B24B37/042 ,  B24B37/02 ,  B24B37/025 ,  B29C70/745 ,  B29C70/88 ,  C03C25/005 ,  F16B11/006

    Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

    Abstract translation: 一种用于共整理表面的方法将由第一材料形成的第一结构粘结在具有由第二材料形成的第二结构中限定的孔中的第一表面，并且具有第二表面，使得在第一表面和第二表面之间存在偏移 第二个表面。 共同研磨第一表面和第二表面以减少偏移。 第一表面和第二表面被共抛光以进一步减少偏移。 然后第一表面和第二表面可以是齐平的。 可以将第一表面的边缘倒角以减轻在共研磨和/或共抛光期间的损伤。 填充材料可以位于第一和第二结构之间的间隙中，以减轻在共研磨和/或共抛光期间的损伤。

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