摘要:
A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要:
An inspection stage including a chuck top, a rectangular Z base, an X stage, a Y stage, and a Z axis elevating mechanism. The chuck top is used for mounting a wafer W. The Z base is provided with the chuck top and is vertically movable. The X stage elevatingly supports the Z base and is movable in an X direction. The Y stage movably supports the X stage in the X direction and is movable in a Y direction. The Z axis elevating mechanism is provided at each of the four corners of the Z base in such a manner as to surround the chuck top.
摘要:
An LCD assembly testing apparatus having a table for supporting the LCD assembly and for applying light to the back of the LCD assembly, and a transport mechanism for removing the LCD assembly from a cassette and transporting the LCD assembly onto the table. The transport mechanism has an arm for holding the LCD assembly, a first lift mechanism for vertical moving the arm, and a pre-alignment mechanism for receiving the LCD assembly and preliminary aligning the LCD assembly with the table. The pre-alignment mechanism has a plurality of support rollers for supporting the LCD assembly in a substantially horizontal position, four pairs of positioning rollers having axes intersecting at substantially right angles and located at level higher than the support rollers, for allowing the LCD assembly to fall naturally onto the support rollers and for holding corners of the LCD assembly, and a second lift mechanism for moving upwards the positioning rollers and the support rollers as the first lift mechanism moves the arm downwards.
摘要:
A transfer apparatus for carrying a semiconductor wafer into a wafer cassette comprising an arm to load a semiconductor wafer thereon, a moving mechanism to move the arm to a wafer cassette, a chucking device to have a wafer attracted to the arm, and an auxiliary mechanism to push a wafer and adjust the position of the wafer to the inlet of a wafer cassette when the wafer comes into contact with the side wall of the wafer cassette.
摘要:
A moving table apparatus includes a base, two guide rails laid on the base and extending in a direction Y, a first table capable of moving on rails, in direction Y, two guide rails laid on the first table and extending a direction X, and a second table capable of moving on the guide rails laid on the first table, in direction X. The first table has a main table located on the side of the base, a support table supporting the second table, and a pin supporting the support table what is rotatable relative to the main table. Before the main and support tables are fastened together by means of screws, the support table is rotated around the pin, thereby adjusting the angle between two straight lines extending in directions X and Y, respectively.
摘要:
The present invention is provided to quickly and efficiently inspect a plurality of CCD sensors. In the present invention, a plurality of openings is formed in a circuit board of a probe card. A plurality of vertical-type probe pins is connected to a lower surface of the circuit board. A guide board is installed at the lower surface of the circuit board, and respective probe pins are inserted into respective guide holes of the guide board. The guide board is made of a transparent glass board. During an inspection, inspection light emitted from a test head passes through the openings of the circuit board and the guide board, so that it is irradiated onto the plurality of CCD sensors on the substrate. Since the plurality of probe pins can be arranged at a narrow pitch without blocking the inspection light, adjacent CCD sensors on the substrate can be inspected simultaneously.
摘要:
An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A through hole is formed in the contactor. In the probe, a fitting/locking portion which can be fitted in this through hole is formed. The fitting/locking portion is formed to penetrate the through hole of the contactor and to be locked in the contactor in a state that a tip thereof is in contact with a connecting terminal of a printed wiring board. The fitting/locking portion itself is locked in the contactor by hooking a locking portion thereof to an end face on an upper side of the through hole.
摘要:
Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要:
A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要:
In a vacuum prober, a head plate is arranged on a prober chamber. A stage, first moving mechanism, recessed chamber, and sealing member are provided in the prober chamber. The stage is arranged below a probe card. The first moving mechanism vertically moves the stage in at least the Z direction. The recessed chamber has a bottom portion and side portion. A lower camera, an upper camera, and the stage are operated to obtain data for alignment. When the upper end of the side portion of the recessed chamber comes into tight contact with the lower surface of the sealing member and a vacuum mechanism evacuates the recessed chamber, a vacuum chamber is formed. As the chamber has a small capacity, the time required for evacuation can be shortened.