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1.发明授权Inspection apparatus to break the oxide of an electrode by fritting phenomenon 有权检查装置通过烧结现象破坏电极的氧化物公开(公告)号：US07319339B2
公开(公告)日：2008-01-15
申请号：US11759816
申请日：2007-06-07
IPC分类号： G01R31/02
CPC分类号： G01R31/2891 , G01R1/067 , G01R1/06794 , G01R3/00 , G01R31/2886
摘要： Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要翻译： 公开了一种通过使检查探针与检查电极电接触来检查装置的电气特性的检查方法。 通过利用烧结现象使形成在检查电极表面上的绝缘膜破裂，从而使检查电极与检查电极电接触。
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2.发明申请公开(公告)号：US20060145716A1
公开(公告)日：2006-07-06
申请号：US11296482
申请日：2005-12-08
IPC分类号： G01R31/02
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
摘要翻译： 形成在台的安装面上的至少一对电极与形成在检查对象物的第一面上的导电层接触，通过烧结现象在两者之间形成电路。
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公开(公告)号：US06777967B2
公开(公告)日：2004-08-17
申请号：US09931888
申请日：2001-08-20
IPC分类号： G01R3102
CPC分类号： G01R31/2891 , G01R1/067 , G01R1/06794 , G01R3/00 , G01R31/2886
摘要： Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
摘要翻译： 公开了一种通过使检查探针与检查电极电接触来检查装置的电气特性的检查方法。 通过利用烧结现象使形成在检查电极表面上的绝缘膜破裂，从而使检查电极与检查电极电接触。
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公开(公告)号：US08650797B2
公开(公告)日：2014-02-18
申请号：US12690527
申请日：2010-01-20
摘要： A DLC-coated fishing lure includes a fishing lure base material made of metal and having a predetermined shape; an intermediate layer made of one selected from a first group, a second group and a third group, the first group consisting of at least one kind of metal selected from the IIIb group, the IVa group, the Va group and the VIa group in the periodic table of elements, the second group consisting of at least one of a carbide, a nitride and a carbonitride of the at least one kind of metal, and the third group consisting of a mutual solid solution made of at least one selected from the first group and the second group, the intermediate layer being formed on a surface of the fishing lure base material; and a DLC layer having a thickness ranging from about 0.05 μm to about 0.55 μm and formed on the intermediate layer, the DLC layer presenting an appearance of a interference color.
摘要翻译： DLC涂层钓鱼诱饵包括由金属制成并具有预定形状的钓鱼诱饵基材; 由选自第一组，第二组和第三组中的一个制成的中间层，第一组由选自IIIb组，IVa组，Va组和VIa组中的至少一种金属组成， 元素周期表，第二组由至少一种金属的碳化物，氮化物和碳氮化物中的至少一种组成，第三组由相互固溶体组成，所述第三组由选自第一 组和第二组，中间层形成在钓鱼诱饵基材的表面上; 以及形成在中间层上的约0.05μm至约0.55μm厚度的DLC层，DLC层具有干涉色的外观。
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公开(公告)号：US07776735B2
公开(公告)日：2010-08-17
申请号：US11889100
申请日：2007-08-09
申请人： Tadatomo Suga , Toshihiro Itoh
发明人： Tadatomo Suga , Toshihiro Itoh
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/49811 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/1319 , H01L2224/16 , H01L2224/7901 , H01L2224/81011 , H01L2224/81012 , H01L2224/81075 , H01L2224/81192 , H01L2224/81801 , H01L2224/81894 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
摘要翻译： 半导体装置技术领域本发明涉及一种半导体装置，其中形成在半导体芯片上的电极和形成在布线板上的电极通过突出的弹性电极电连接，还涉及一种降低施加到形成在基板上的电极的压力的安装方法， 当半导体芯片和布线板接合时的底部布线。
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公开(公告)号：US20080254610A1
公开(公告)日：2008-10-16
申请号：US11889100
申请日：2007-08-09
申请人： Tadatomo SUGA , Toshihiro ITOH
发明人： Tadatomo SUGA , Toshihiro ITOH
IPC分类号： H01L21/44
CPC分类号： H01L24/81 , H01L21/4846 , H01L23/49811 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/1319 , H01L2224/16 , H01L2224/7901 , H01L2224/81011 , H01L2224/81012 , H01L2224/81075 , H01L2224/81192 , H01L2224/81801 , H01L2224/81894 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/19043 , H01L2924/351 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
摘要翻译： 半导体装置技术领域本发明涉及一种半导体装置，其中形成在半导体芯片上的电极和形成在布线板上的电极通过突出的弹性电极电连接，还涉及一种降低施加到形成在基板上的电极的压力的安装方法， 当半导体芯片和布线板接合时的底部布线。
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7.发明申请公开(公告)号：US20080174325A1
公开(公告)日：2008-07-24
申请号：US12007403
申请日：2008-01-10
IPC分类号： G01R31/02
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
摘要翻译： 形成在台的安装面上的至少一对电极与形成在检查对象物的第一面上的导电层接触，通过烧结现象在两者之间形成电路。
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公开(公告)号：US07262613B2
公开(公告)日：2007-08-28
申请号：US11296482
申请日：2005-12-08
IPC分类号： G01R31/02
CPC分类号： G01R1/07357 , G01R31/2887
摘要： At least one pair of electrode formed on a mounting surface of a stage is in contact with a conductive layer formed on a first surface of an inspection object, and an electrical path is formed between the both by using a fritting phenomenon.
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公开(公告)号：US20040174177A1
公开(公告)日：2004-09-09
申请号：US10802882
申请日：2004-03-18
IPC分类号： G01R031/02
CPC分类号： G01R31/2891 , G01R1/067 , G01R1/06794 , G01R3/00 , G01R31/2886
摘要： Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.
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公开(公告)号：US20100212210A1
公开(公告)日：2010-08-26
申请号：US12690527
申请日：2010-01-20
IPC分类号： A01K85/00
摘要： A DLC-coated fishing lure includes a fishing lure base material made of metal and having a predetermined shape; an intermediate layer made of one selected from a first group, a second group and a third group, the first group consisting of at least one kind of metal selected from the IIIb group, the IVa group, the Va group and the VIa group in the periodic table of elements, the second group consisting of at least one of a carbide, a nitride and a carbonitride of the at least one kind of metal, and the third group consisting of a mutual solid solution made of at least one selected from the first group and the second group, the intermediate layer being formed on a surface of the fishing lure base material; and a DLC layer having a thickness ranging from about 0.05 μm to about 0.55 μm and formed on the intermediate layer, the DLC layer presenting an appearance of a interference color.
摘要翻译： DLC涂层钓鱼诱饵包括由金属制成并具有预定形状的钓鱼诱饵基材; 由选自第一组，第二组和第三组中的一个制成的中间层，第一组由选自IIIb组，IVa组，Va组和VIa组中的至少一种金属组成， 元素周期表，第二组由至少一种金属的碳化物，氮化物和碳氮化物中的至少一种组成，第三组由相互固溶体组成，所述第三组由选自第一 组和第二组，中间层形成在钓鱼诱饵基材的表面上; 以及形成在中间层上的厚度为约0.05μm至约0.55μm的DLC层，DLC层具有干涉色的外观。
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