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公开(公告)号：CN87107402A
公开(公告)日：1988-06-22
申请号：CN87107402
申请日：1987-12-12
Applicant: 株式会社东芝
Inventor： 薄田修
CPC classification number: H01L24/05 , H01L23/53223 , H01L23/53242 , H01L23/53247 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05172 , H01L2224/05181 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/85201 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01073 , H01L2924/01079 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00015 , H01L2924/01006
Abstract: 在把铜或铜合金焊接引线(16)压焊到半导体元件(13)的电极压焊区(21)上的半导体器件中，电极压焊区(21)由与半导体元件形成欧姆接触的第一金属层(18)，其硬度足以在引线焊接时不产生变形的第二金属层(19)以及用于焊接铜引线的第三金属层(20)构成，结果抑制了焊接部位电学性能的变化，并在引线焊接时抑制在半导体元件中产生应力。
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公开(公告)号：CN85106110B
公开(公告)日：1987-12-09
申请号：CN85106110
申请日：1985-08-13
Applicant: 株式会社东芝
IPC: H01L21/603
CPC classification number: H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85075 , H01L2224/85181 , H01L2224/85201 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15747 , H01L2924/00014 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 一个引线框在充满还原性气体的传送通道中沿传送方向传送。在芯片焊接位置，将半导体芯片放在引线框上。铜或铜合金制做的金属丝提供给相邻的下一个金属丝压焊位置。用气罩包围的氢氧焰来熔化金属丝的下部未端，以形成一个球状体。金属丝由一根毛细管送入到传送通道内。球状体被热压到半导体芯片的电极层上，金属丝的另一端被熔断并在后步压焊位置被热压到引线框的外引线上，从而金属丝被连接在半导体芯片和外引线之间。
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公开(公告)号：CN1020029C
公开(公告)日：1993-03-03
申请号：CN87107402
申请日：1987-12-12
Applicant: 株式会社东芝
Inventor： 薄田修
IPC: H01L23/488 , H01L21/28
CPC classification number: H01L24/05 , H01L23/53223 , H01L23/53242 , H01L23/53247 , H01L24/45 , H01L24/48 , H01L2224/04042 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05172 , H01L2224/05181 , H01L2224/05556 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4807 , H01L2224/48091 , H01L2224/48453 , H01L2224/48463 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48724 , H01L2224/48744 , H01L2224/48747 , H01L2224/48844 , H01L2224/48847 , H01L2224/85201 , H01L2224/85205 , H01L2924/00011 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01073 , H01L2924/01079 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/00014 , H01L2924/00 , H01L2224/48824 , H01L2924/00015 , H01L2924/01006
Abstract: 在把铜或铜合金焊接引线(16)压焊到半导体元件(13)的电极压焊区(21)上的半导体器件中，电极压焊区(21)由与半导体元件形成欧姆接触的第一金属层(18)，其硬度足以在引线焊接时不产生变形的第二金属层(19)以及用于焊接铜引线的第三金属层(20)构成，结果抑制了焊接部位电学性能的变化，并在引线焊接时抑制在半导体元件中产生应力。
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公开(公告)号：CN85106110A
公开(公告)日：1986-10-01
申请号：CN85106110
申请日：1985-08-13
Applicant: 株式会社东芝
IPC: H01L21/603
CPC classification number: H01L24/97 , H01L24/73 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78 , H01L2224/78301 , H01L2224/85 , H01L2224/85075 , H01L2224/85181 , H01L2224/85201 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/15747 , H01L2924/00014 , H01L2224/83 , H01L2924/00 , H01L2924/00012
Abstract: 一个引线框在充满还原性气体的传送通道中沿传送方向传送。在芯片焊接位置，将半导体芯片放在引线框上。铜或铜合金制做的金属丝提供给相邻的下一个金属丝压焊位置。用气罩包围的氢氧焰来熔化金属丝的下部末端，以形成一个球状体。金属丝由一根毛细管送入到传送通道内。球状体被热压到半导体芯片的电极层上。金属丝的另一端被熔断并在后步压焊位置被热压到引线框的外引线上，从而金属丝被连接在半导体芯片和外引线之间。
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