- 专利标题： 3DIC packaging with hot spot thermal management features
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申请号： US14096952申请日： 2013-12-04
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公开(公告)号： US09735082B2公开(公告)日： 2017-08-15
- 发明人: Wensen Hung , Szu-Po Huang , Hsiang-Fan Lee , Kim Hong Chen , Chi-Hsi Wu , Shin-Puu Jeng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/544
- IPC分类号： H01L23/544 ; H01L23/36 ; H01L23/04 ; H01L23/10 ; H01L25/065 ; H01L23/367 ; H01L23/42 ; H01L23/00 ; H01L25/18 ; H01L23/498
摘要：
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
公开/授权文献
- US20150155218A1 3DIC Packaging with Hot Spot Thermal Management Features 公开/授权日：2015-06-04
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