- 专利标题： Power amplifier modules including wire bond pad and related systems, devices, and methods
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申请号： US14686559申请日： 2015-04-14
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公开(公告)号： US09660584B2公开(公告)日： 2017-05-23
- 发明人: Hardik Bhupendra Modi , Sandra Louise Petty-Weeks , Hongxiao Shao , Weimin Sun , Peter J. Zampardi, Jr. , Guohao Zhang
- 申请人： Skyworks Solutions, Inc.
- 申请人地址： US MA Woburn
- 专利权人： Skyworks Solutions, Inc.
- 当前专利权人： Skyworks Solutions, Inc.
- 当前专利权人地址： US MA Woburn
- 代理机构： Knobbe, Martens, Olson & Bear, LLP
- 主分类号： H03F3/195
- IPC分类号： H03F3/195 ; H03F1/02 ; H03F3/19 ; H03F3/21 ; H03F3/24 ; H01L23/552 ; H01L23/66 ; H01L23/00 ; H01L29/36 ; H01L29/66 ; H01L29/737 ; H01L29/812 ; H01L29/08 ; H01L29/205 ; H01L27/06 ; H01L23/498 ; H01L23/50 ; H03F3/60 ; H03F3/213 ; H03F3/187 ; H03F3/347 ; H01L29/8605 ; H01L21/8252 ; H01L27/092 ; H03F3/45
摘要：
One aspect of this disclosure is a power amplifier module that includes a power amplifier; a wire bond pad electrically connected to the power amplifier, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer; and a conductive trace having a top surface with a plated portion and an unplated portion surrounding the plated portion, the wire bond pad being disposed over the plated portion. Other embodiments of the module are provided along with related methods and components thereof.
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