发明授权
- 专利标题： Packaging methods and structures using a die attach film
- 专利标题（中）： 使用管芯附着膜的包装方法和结构
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申请号： US13228244申请日： 2011-09-08
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公开(公告)号： US09064879B2公开(公告)日： 2015-06-23
- 发明人: Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu
- 申请人： Jui-Pin Hung , Jing-Cheng Lin , Nai-Wei Liu , Chin-Chuan Chang , Chen-Hua Yu , Shin-Puu Jeng , Chin-Fu Kao , Yi-Chao Mao , Szu Wei Lu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/56 ; H01L23/14 ; H01L23/498 ; H01L23/538 ; H01L21/683 ; H01L23/31 ; H01L23/00
摘要：
Packaging methods and structures for semiconductor devices that utilize a novel die attach film are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a carrier wafer and forming a die attach film (DAF) that includes a polymer over the carrier wafer. A plurality of dies is attached to the DAF, and the plurality of dies is packaged. At least the carrier wafer is removed from the packaged dies, and the packaged dies are singulated.
公开/授权文献
- US20130062760A1 Packaging Methods and Structures Using a Die Attach Film 公开/授权日：2013-03-14
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