Invention Grant
- Patent Title: Semiconductor device and method for manufacturing same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13805279Application Date: 2011-07-14
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Publication No.: US08981384B2Publication Date: 2015-03-17
- Inventor: Takeyoshi Masuda
- Applicant: Takeyoshi Masuda
- Applicant Address: JP Osaka-shi
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Venable LLP
- Agent Michael A. Sartori; Tamatane J. Aga
- Priority: JP2010-174664 20100803
- International Application: PCT/JP2011/066096 WO 20110714
- International Announcement: WO2012/017798 WO 20120209
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L29/861 ; H01L21/3065 ; H01L29/739 ; H01L29/04 ; H01L29/16 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L21/04 ; H01L29/06

Abstract:
There are provided a high-quality semiconductor device having stable characteristics and a method for manufacturing such a semiconductor device. The semiconductor device includes a substrate having a main surface, and a silicon carbide layer. The silicon carbide layer is formed on the main surface of the substrate. The silicon carbide layer includes a side surface as an end surface inclined relative to the main surface. The side surface substantially includes one of a {03-3-8} plane and a {01-1-4} plane in a case where the silicon carbide layer is of hexagonal crystal type, and substantially includes a {100} plane in a case where the silicon carbide layer is of cubic crystal type.
Public/Granted literature
- US20130112996A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-05-09
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