Invention Grant
- Patent Title: Substrate polishing apparatus
- Patent Title (中): 基材抛光装置
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Application No.: US10142382Application Date: 2002-05-08
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Publication No.: US06951507B2Publication Date: 2005-10-04
- Inventor: Homayoun Talieh
- Applicant: Homayoun Talieh
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B7/22 ; B24B21/00 ; B24B21/04 ; B24B21/06 ; B24B27/00 ; B24B37/04 ; B24B41/047 ; B24B41/06 ; B24B49/10 ; B24B49/16 ; B24B53/007
Abstract:
A chemical mechanical polishing apparatus includes a rotating plate on which a substrate received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.
Public/Granted literature
- US20030032372A1 Substrate polishing apparatus Public/Granted day:2003-02-13
Information query
