Invention Publication
- Patent Title: SILICON CARBIDE SEMICONDUCTOR SUBSTRATE, METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR SUBSTRATE, SILICON CARBIDE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
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Application No.: US18497450Application Date: 2023-10-30
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Publication No.: US20240204051A1Publication Date: 2024-06-20
- Inventor: Kensuke TAKENAKA , Takeshi TAWARA , Shinsuke HARADA
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Priority: JP 22200640 2022.12.15
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/04 ; H01L21/66 ; H01L29/10 ; H01L29/16 ; H01L29/66 ; H01L29/78

Abstract:
A silicon carbide semiconductor substrate has a silicon carbide semiconductor substrate of a first conductivity type and a first semiconductor layer of the first conductivity type, provided at a front surface of the silicon carbide semiconductor substrate and having a doping concentration lower than that of the silicon carbide semiconductor substrate. A portion of the first semiconductor layer contains a dopant of a second conductivity type. A concentration of the dopant of the second conductivity type in the first semiconductor layer differs in a direction parallel to an orientation flat or in a direction orthogonal to the orientation flat, the orientation flat indicating a crystal axis direction, such that a distribution of a net doping concentration in the first semiconductor layer has a variation equal to or less than a predetermined threshold.
Information query
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