- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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申请号: US17862243申请日: 2022-07-11
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公开(公告)号: US20220351973A1公开(公告)日: 2022-11-03
- 发明人: Kazuki KAMIMURA , Motoyoshi KUBOUCHI
- 申请人: FUJI ELECTRIC CO., LTD.
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人: FUJI ELECTRIC CO., LTD.
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2020-104316 20200617,JP2020-211843 20201221
- 主分类号: H01L21/22
- IPC分类号: H01L21/22 ; H01L27/06 ; H01L29/06 ; H01L29/10 ; H01L29/32 ; H01L21/8222 ; H01L29/861 ; H01L21/265 ; H01L21/268 ; H01L29/66 ; H01L29/739
摘要:
A semiconductor device has transistor portions and diode portions. The transistor portions have a semiconductor substrate of a first conductivity type, a first semiconductor region of a second conductivity type, second semiconductor regions of the first conductivity type, gate insulating films, gate electrodes, a first semiconductor layer of the first conductivity type, a third semiconductor region of the second conductivity type, a first electrode, and a second electrode. The diode portions have the semiconductor substrate, the first semiconductor region, the first semiconductor layer, a fourth semiconductor region of the first conductivity type, the first electrode, and the second electrode. The first semiconductor layer has a predetermined region, a depth of the predetermined region from a second main surface of the semiconductor substrate is greater than a depth of a region of the first semiconductor layer excluding the predetermined region, from the second main surface of the semiconductor substrate.
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