Invention Application
- Patent Title: Method for Annealing a Gate Insulation Layer on a Wide Band Gap Semiconductor Substrate
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Application No.: US17666654Application Date: 2022-02-08
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Publication No.: US20220157607A1Publication Date: 2022-05-19
- Inventor: Thomas Aichinger , Gerald Rescher , Michael Stadtmueller
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102018107966.4 20180404
- Main IPC: H01L21/04
- IPC: H01L21/04 ; H01L21/02 ; H01L29/16 ; H01L29/78 ; H01L29/66 ; H01L29/40 ; H01L29/10

Abstract:
A method for forming a wide band gap semiconductor device is provided. The method includes forming a gate insulation layer on a wide band gap semiconductor substrate and annealing the gate insulation layer using at least a first reactive gas species and a second reactive gas species, wherein the first reactive gas species differs from the second reactive gas species. The method can include forming a gate electrode on the gate insulation layer after annealing the gate insulation layer.
Information query
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