Invention Application
- Patent Title: CAVITY PACKAGES
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Application No.: US17146304Application Date: 2021-01-11
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Publication No.: US20210134689A1Publication Date: 2021-05-06
- Inventor: Shaowu Huang , Javier A. DeLaCruz , Liang Wang , Rajesh Katkar , Belgacem Haba
- Applicant: Invensas Bonding Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Invensas Bonding Technologies, Inc.
- Current Assignee: Invensas Bonding Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/66 ; H01L23/04
Abstract:
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
Public/Granted literature
- US11600542B2 Cavity packages Public/Granted day:2023-03-07
Information query
IPC分类:
