Invention Application
- Patent Title: 3DIC Packaging with Hot Spot Thermal Management Features
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Application No.: US16587463Application Date: 2019-09-30
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Publication No.: US20200027809A1Publication Date: 2020-01-23
- Inventor: Wensen Hung , Szu-Po Huang , Hsiang-Fan Lee , Kim Hong Chen , Chi-Hsi Wu , Shin-Puu Jeng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L23/04 ; H01L23/10 ; H01L25/065 ; H01L23/367 ; H01L23/42 ; H01L23/498
Abstract:
A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
Public/Granted literature
- US11037852B2 3DIC packaging with hot spot thermal management features Public/Granted day:2021-06-15
Information query
IPC分类:
