发明申请
- 专利标题: Vertical Semiconductor Device
- 专利标题(中): 立式半导体器件
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申请号: US14679514申请日: 2015-04-06
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公开(公告)号: US20150303260A1公开(公告)日: 2015-10-22
- 发明人: Franz Josef Niedernostheide , Manfred Pfaffenlehner , Hans-Joachim Schulze , Holger Schulze , Frank Umbach , Christoph Weiss
- 申请人: Infineon Technologies AG
- 优先权: DE102014005879.4 20140416
- 主分类号: H01L29/06
- IPC分类号: H01L29/06 ; H01L29/78 ; H01L29/861 ; H01L21/283 ; H01L29/66 ; H01L23/31 ; H01L21/56 ; H01L29/739 ; H01L29/40
摘要:
A semiconductor body includes first and second opposing surfaces, an edge extending in a vertical direction substantially perpendicular to the first surface, an active area, a peripheral area arranged in a horizontal direction substantially parallel to the first surface between the active area and edge, and a pn-junction extending from the active area into the peripheral area. In the peripheral area the semiconductor device further includes a first conductive region arranged next to the first surface, a second conductive region arranged next to the first surface, and arranged in the horizontal direction between the first conductive region and edge, and a passivation structure including a first portion at least partly covering the first conductive region, a second portion at least partly covering the second conductive region. The first portion has a different layer composition than the second portion and/or a thickness which differs from the thickness of the second portion.
公开/授权文献
- US10957764B2 Vertical semiconductor device 公开/授权日:2021-03-23
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