Invention Grant
- Patent Title: Semiconductor device, and method of manufacturing semiconductor device
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Application No.: US18310554Application Date: 2023-05-02
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Publication No.: US12205993B2Publication Date: 2025-01-21
- Inventor: Hiroki Wakimoto , Hiroshi Takishita , Takashi Yoshimura , Takahiro Tamura , Yuichi Onozawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2014-204849 20141003
- Main IPC: H01L29/36
- IPC: H01L29/36 ; H01L21/22 ; H01L21/265 ; H01L21/324 ; H01L29/06 ; H01L29/32 ; H01L29/66 ; H01L29/739 ; H01L29/861 ; H01L27/06

Abstract:
A p-type semiconductor region is formed in a front surface side of an n-type semiconductor substrate. An n-type field stop (FS) region including protons as a donor is formed in a rear surface side of the semiconductor substrate. A concentration distribution of the donors in the FS region include first, second, third and fourth peaks in order from a front surface to the rear surface. Each of the peaks has a peak maximum point, and peak end points formed at both sides of the peak maximum point. The peak maximum points of the first and second peaks are higher than the peak maximum point of the third peak. The peak maximum point of the third peak is lower than the peak maximum point of the fourth peak.
Public/Granted literature
- US20230275129A1 SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2023-08-31
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