Invention Grant
- Patent Title: Package system and package
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Application No.: US17131863Application Date: 2020-12-23
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Publication No.: US12009321B2Publication Date: 2024-06-11
- Inventor: Zhen Zhou , Tae Young Yang , Tolga Acikalin , Johanny Escobar Pelaez , Kenneth P. Foust , Chia-Pin Chiu , Renzhi Liu , Cheng-Yuan Chin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/14 ; H01L29/93 ; H01Q1/22 ; H01Q1/42 ; H01Q15/00 ; H01Q15/14

Abstract:
In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.
Public/Granted literature
- US20220199556A1 PACKAGE SYSTEM AND PACKAGE Public/Granted day:2022-06-23
Information query
IPC分类: