Invention Grant
- Patent Title: Method of determining control parameters of a device manufacturing process
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Application No.: US16644206Application Date: 2018-08-22
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Publication No.: US11513442B2Publication Date: 2022-11-29
- Inventor: Wim Tjibbo Tel , Mark John Maslow , Koenraad Van Ingen Schenau , Patrick Warnaar , Abraham Slachter , Roy Anunciado , Simon Hendrik Celine Van Gorp , Frank Staals , Marinus Jochemsen
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Priority: EP17193430 20170927,EP17200255 20171107,EP18155070 20180205
- International Application: PCT/EP2018/072605 WO 20180822
- International Announcement: WO2019/063206 WO 20190404
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F1/00 ; G06T7/00 ; H01L21/00 ; G06F30/20 ; G21K5/00 ; G03F7/20 ; H01L21/66 ; G06F119/18

Abstract:
A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.
Public/Granted literature
- US20210149312A1 METHOD OF DETERMINING CONTROL PARAMETERS OF A DEVICE MANUFACTURING PROCESS Public/Granted day:2021-05-20
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