- 专利标题: Stage device and processing apparatus
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申请号: US16660696申请日: 2019-10-22
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公开(公告)号: US11417504B2公开(公告)日: 2022-08-16
- 发明人: Manabu Nakagawasai , Naoyuki Suzuki , Shinji Orimoto , Hiroyuki Yokohara , Motoi Yamagata , Koji Maeda
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Fenwick & West LLP
- 优先权: JPJP2018-200491 20181025,JPJP2019-050290 20190318
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; C23C14/34 ; C23C14/50 ; C23C14/54 ; H01L21/683 ; H01F41/32 ; H01L43/12 ; H01J37/34 ; H01L21/673
摘要:
A stage device includes a stage configured to hold a target substrate in a vacuum chamber, a cold heat transfer body fixedly disposed below a bottom surface of the stage with a gap between the stage and the cold heat transfer body and cooled to an extremely low temperature by a chiller disposed below the cold heat transfer body, and cooling fluid supplied to the gap to transfer cold heat of the cold heat transfer body to the stage. The stage device further includes a stage support configured to rotatably support the stage and formed in a cylindrical shape to surround an upper part of the cold heat transfer body wherein the stage support has a vacuum insulation structure, and a rotation part configured to support the stage support and rotated by a driving mechanism while being sealed with magnetic fluid.
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