公开(公告)号：US20240021410A1

公开(公告)日：2024-01-18

申请号：US17865225

申请日：2022-07-14

Applicant: Tokyo Electron Limited

Inventor： Jianping Zhao ,  John Carroll ,  Charles Schlechte ,  Peter Lowell George Ventzek

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32128 ,  H01J37/32146 ,  H01J37/32541 ,  H01J37/3299 ,  H01J2237/24564

Abstract: A plasma system includes a plasma apparatus including: a plasma chamber; a pedestal configured to hold a substrate in the chamber; and a radio frequency (RF) electrode configured to excite plasma in the chamber; an electromagnetic (EM) circuit block coupled to the RF electrode, the EM circuit block including: a function generator configured to output a broadband RF waveform, the waveform having EM power distributed over a range of frequencies; a broadband amplifier coupled to an output of the function generator, an operating frequency range of the amplifier including the range of frequencies; and a broadband impedance matching network having an input coupled to an output of the broadband amplifier and an output coupled to a terminal of the RF electrode, an operating frequency range of the broadband impedance matching network including the range of frequencies; and a controller configured to adjust an input parameter of the EM circuit block.

公开(公告)号：US20250069940A1

公开(公告)日：2025-02-27

申请号：US18946976

申请日：2024-11-14

Applicant: Tokyo Electron Limited

Inventor： Norihiko AMIKURA ,  Masatomo KITA ,  Masahiro DOGOME ,  Takami FUKASAWA ,  Daisuke HAYASHI ,  Toshiaki TOYOMAKI

IPC: H01L21/687 ,  B25J11/00 ,  H01L21/683

Abstract: A transfer device for simultaneously or separately transferring a wafer and a consumable part having a circular shape is disclosed. The consumable part is disposed in a wafer processing module, and the outer diameter of the consumable part is larger than the outer diameter of the wafer. The transfer device comprises an end effector configured to place the wafer and the consumable part thereon simultaneously or separately, an arm configured to move the end effector, and a controller configured to control the arm, to place the consumable part on the end effector such that the center of gravity of the consumable part coincides with a first position when transferring the consumable part, and to place the wafer on the end effector such that the center of gravity of the wafer coincides with a second position between the first position and front ends of the end effector when transferring the wafer.

公开(公告)号：US20250069863A1

公开(公告)日：2025-02-27

申请号：US18939729

申请日：2024-11-07

Applicant: Tokyo Electron Limited

Inventor： Chishio KOSHIMIZU

IPC: H01J37/32

Abstract: In the disclosed plasma processing apparatus, the substrate support includes a base and a dielectric portion on the base. The dielectric portion includes a first region configured to support a substrate placed thereon and a second region configured to support an edge ring placed thereon. First and second bias electrodes are disposed in the first and second regions, respectively. A shortest distance dW1 between a placement position of the substrate in the first region and the first bias electrode is not larger than a shortest distance dWE between the first bias electrode and a placement position of the edge ring in the second region. A shortest distance dE1 between the second bias electrode and the placement position of the edge ring is not larger than a shortest distance dEW between the second bias electrode and the placement position of the substrate.

公开(公告)号：US20250069852A1

公开(公告)日：2025-02-27

申请号：US18453875

申请日：2023-08-22

Applicant: Tokyo Electron Limited

Inventor： Justin Moses ,  Merritt Funk ,  Chelsea DuBose ,  Barton Lane

IPC: H01J37/32 ,  H01L21/311

Abstract: A method for multitone plasma processing includes providing a substrate into a plasma processing chamber, igniting a plasma in the plasma processing chamber with a multitone signal, and performing a first plasma process on the substrate with the plasma. The multitone signal includes a first tone and a second tone.

公开(公告)号：US20250067664A1

公开(公告)日：2025-02-27

申请号：US18726285

申请日：2022-12-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hirokazu UEDA ,  Masafumi ASANO ,  Takanobu KAITSUKA ,  Yuji OTSUKI ,  Yasutoshi UMEHARA

IPC: G01N21/3563 ,  B23K26/364 ,  C23C16/02 ,  C23C16/04 ,  C23C16/52 ,  G01N21/95

Abstract: There is provided a determination method comprising: a post-embedding measurement step for performing spectroscopic measurement on a substrate in which a pattern including a recess is formed, the recess having an embedding material embedded therein, and measuring an absorbance spectrum of the substrate having the embedding material embedded therein; and a determination step for determining an embedded state of the recess based on an integrated value of an intensity of the measured absorbance spectrum of the substrate at a plurality of wavenumbers.

公开(公告)号：US20250067556A1

公开(公告)日：2025-02-27

申请号：US18944260

申请日：2024-11-12

Applicant: Tokyo Electron Limited

Inventor： Yuji OTSUKI ,  Munehito KAGAYA ,  Yusuke SUZUKI

IPC: G01B11/06 ,  H01L21/66

Abstract: A method of measuring a film thickness includes: storing, in a storage, relationship information indicating a relationship between an absorbance spectrum of a substrate, which has a recess formed therein and is subjected to substrate processing, and a film thickness of a film in the substrate subjected to the substrate processing, the absorbance spectrum being within a range including a peak of at least one of LO (Longitudinal Optical) phonons or TO (Transverse Optical) phonons of the film present on a surface of the substrate; performing the substrate processing on the substrate having the recess formed therein; measuring the absorbance spectrum of the substrate subjected to the substrate processing; and deriving, based on the relationship information, the film thickness of the film present on the surface of the substrate subjected to the substrate processing, from the measured absorbance spectrum.

公开(公告)号：US20250067350A1

公开(公告)日：2025-02-27

申请号：US18810920

申请日：2024-08-21

Applicant: Tokyo Electron Limited

Inventor： Kaisei Yamashita

IPC: F16K11/00 ,  F17D1/08

Abstract: A flow divider includes a flow divider main body having a guide flow path; an inlet through which a liquid is guided into the guide flow path; and a first outlet and a second outlet through which the liquid is discharged to an outside from the guide flow path. The first outlet is located above the second outlet, and when a bubble exists in the liquid within the guide flow path, a volume of the bubble flowing out to the outside along with the liquid through the second outlet is smaller than a volume of the bubble flowing out to the outside along with the liquid through the first outlet.

公开(公告)号：US20250066916A1

公开(公告)日：2025-02-27

申请号：US18944529

申请日：2024-11-12

Applicant: Tokyo Electron Limited

Inventor： Hiroki IRIUDA ,  Yoichiro CHIBA ,  Atsushi ENDO

IPC: C23C16/455 ,  C23C16/52

Abstract: A processing apparatus includes: a processing container having a substantially cylindrical shape and provided with an exhaust slit on a side wall; and a first pair of gas nozzles extending in a vertical direction along an inside of the side wall of the processing container and disposed symmetrically with respect to a straight line extending from a center of the exhaust slit to a portion of the side wall positioned opposite to the exhaust slit via a center of the processing container; a second pair of gas nozzle disposed symmetrically with respect to the straight line; at least one memory storing executable instructions; and at least one processor configured to execute the executable instructions to: control the first pair of gas nozzles and the second pair of gas nozzles to eject a same processing gas into the processing container.

公开(公告)号：US12238663B2

公开(公告)日：2025-02-25

申请号：US18354509

申请日：2023-07-18

Applicant: TOKYO ELECTRON LIMITED ,  Aval Data Corporation

Inventor： Tomoya Bessho ,  Akihito Mitsumine

IPC: H04W56/00 ,  C23C16/455 ,  C23C16/52 ,  H04W76/10 ,  H04W84/12

Abstract: There is provided a wireless communication system for transmitting periodic data from a first device to a plurality of second devices by wireless communication comprising: a first wireless device connected to the first device; and a plurality of second wireless devices connected to the plurality of second devices, respectively, wherein the first wireless device includes a first wireless portion and a first control portion, the second wireless device includes a second wireless portion and a second control portion, and the first control portion and the second control portion synchronize the first wireless device and the plurality of second wireless devices when a time until the first wireless device receives a response from the second wireless device after the first wireless device has transmitted the periodic data from the first device is equal to or less than a set value.

公开(公告)号：US12237167B2

公开(公告)日：2025-02-25

申请号：US17648438

申请日：2022-01-20

Applicant: Tokyo Electron Limited

Inventor： Ken Okoshi ,  Yamato Tonegawa ,  Keiji Tabuki

IPC: H01L21/02 ,  C23C16/34 ,  C23C16/458

Abstract: With respect to a method of depositing a silicon nitride film on a surface of a substrate, the method includes depositing the silicon nitride film on the surface of the substrate by intermittently supplying trisilylamine into a processing chamber accommodating the substrate.