- 专利标题: Semiconductor device and method of fabricating the same
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申请号: US16450193申请日: 2019-06-24
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公开(公告)号: US10784376B2公开(公告)日: 2020-09-22
- 发明人: Ki Hwan Kim , Gigwan Park , Junggun You , DongSuk Shin , Jin-Wook Kim
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@398c9b16
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/8238 ; H01L23/535 ; H01L27/092 ; H01L27/11 ; H01L29/06 ; H01L29/08 ; H01L29/16 ; H01L29/161 ; H01L29/66 ; H01L27/12 ; H01L21/84 ; H01L29/165
摘要:
A semiconductor device includes first and second active patterns protruding upward from a substrate, a gate electrode crossing the first and second active patterns and extending in a first direction, a first source/drain region on the first active pattern and on at least one side of the gate electrode, and a second source/drain region on the second active pattern and on at least one side of the gate electrode. The first and second source/drain regions have a conductivity type different from each other, and the second source/drain region has a bottom surface in contact with a top surface of the second active pattern and at a lower level than that of a bottom surface of the first source/drain region in contact with a top surface of the first active pattern. The first active pattern has a first width smaller than a second width of the second active pattern.
公开/授权文献
- US20190319127A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 公开/授权日:2019-10-17
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