Invention Grant
- Patent Title: Semiconductor device, and method of manufacturing semiconductor device
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Application No.: US15169740Application Date: 2016-06-01
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Publication No.: US10312331B2Publication Date: 2019-06-04
- Inventor: Hiroki Wakimoto , Hiroshi Takishita , Takashi Yoshimura , Takahiro Tamura , Yuichi Onozawa
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP2014-204849 20141003
- Main IPC: H01L21/22
- IPC: H01L21/22 ; H01L27/06 ; H01L29/06 ; H01L29/32 ; H01L29/36 ; H01L29/66 ; H01L21/265 ; H01L21/324 ; H01L29/739 ; H01L29/861

Abstract:
A semiconductor device comprises: an n-type semiconductor substrate; a p-type anode region formed in the semiconductor substrate on its front surface side; an n-type field stop region formed in the semiconductor substrate on its rear surface side with protons as a donor; and an n-type cathode region formed in the semiconductor substrate to be closer to its rear surface than the field stop region is, wherein a concentration distribution of the donor in the field stop region in its depth direction has a first peak, and a second peak that is closer to the rear surface of the semiconductor substrate than the first peak is, and has a concentration lower than that of the first peak, and a carrier lifetime in at least a partial region between the anode region and the cathode region is longer than carrier lifetimes in the anode region.
Public/Granted literature
- US20160276446A1 SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2016-09-22
Information query
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