The invention discloses chemical mechanical polishing equipment and an operation method of the chemical mechanical polishing equipment. The chemical mechanical polishing equipment comprises a clampingpiece assembly, a holding ring and a polishing disc, wherein a polishing piece is mounted on the clamping piece assembly, the holding ring is arranged on the clamping piece assembly, and the polishing piece is located in the holding ring; and the polishing disc is arranged below the holding ring and the polishing ring. The chemical mechanical polishing equipment is characterized by further comprising a holding ring adjustment device; the holding ring adjustment device comprises an adjusting device and a pressure distribution detection device, wherein the adjusting device comprises pull rods for upwardly adjusting the holding ring and press rods downwardly adjusting the holding ring; and the pressure distribution detection device is arranged on the polishing disc and is used for detectingthe pressure distribution between the holding ring and the polishing disc and between the polishing piece and the polishing disc. The adjusting device is used for adjusting the holding ring accordingto the detection information of the pressure distribution detection device. According to the chemical mechanical polishing equipment, the surface figure accuracy of the polished polishing piece can beguaranteed, and the polishing effect is improved.