The invention provides a flexible mechanical photoetching stripping process method of a silicon substrate or a ceramic substrate, and relates to a flexible mechanical photoetching stripping process manufacturing method in micro mechanical processing. The flexible mechanical photoetching stripping process method solves the problem that when a reversal glue photoetching stripping process method is adopted for carrying out platinum film photoetching stripping on the silicon substrate or the ceramic substrate in the prior art, the defects of great pollution, process procedure complexity and poor mechanical performance are caused. According to the process method, the aluminum nitride ceramic substrate or the silicon substrate is adopted as a substrate to be respectively cleaned in acetone solution and alcoholic solution and is then subjected to uniform gluing under the ultrasonic effect, the exposure, the developing and the film coating are then carried out by using a reverse graphic mask template of preparation device patterns as plate making graphics, next, the ultrasonic photoresist cleaning is carried out until photoresist is completely dissolved, a flexible two-way stretching polypropylene pressure sensitive adhesive tape is adopted to be attached onto the substrate after the photoresist dissolving, the external force is exerted, finally, the annealing treatment is carried out, and the flexible mechanical photoetching stripping of the ceramic substrate or the silicon substrate is realized. The flexible mechanical photoetching stripping process method is applicable to the photoetching stripping of the ceramic substrate or the silicon substrate.