-
公开(公告)号：US20240212889A1
公开(公告)日：2024-06-27
申请号：US18598952
申请日：2024-03-07
申请人： ROHM CO., LTD.
发明人： Takanori SHINOURA
摘要： A chip resistor includes an insulating substrate, a first electrode, a second electrode, a first resistive element, a second resistive element, and an intermediate electrode. A first length of the first resistive element in a first direction in which the first resistive element and the second resistive element are separated from each other is longer than a second length of the second resistive element in the first direction. The first resistive element is provided with a first trimming groove. The second resistive element is provided with a second trimming groove.
-
公开(公告)号：US20240029925A1
公开(公告)日：2024-01-25
申请号：US18482101
申请日：2023-10-06
申请人： ROHM CO., LTD.
发明人： Kosaku TANAKA
摘要： A resistor includes a first insulator, a resistive body, a second insulator, a pair of electrodes, and a covering body. The first insulator has a first obverse surface facing in a thickness direction thereof. The resistive body is provided on the first obverse surface. The second insulator covers the resistive body. The pair of electrodes are electrically connected to the resistive body at both sides in a first direction perpendicular to the thickness direction. The covering body is formed on at least one of the first insulator and the second insulator. The covering body has electrical conductivity. The first layer is in contact with at least one of the first insulator and the second insulator.
-
公开(公告)号：US20240013955A1
公开(公告)日：2024-01-11
申请号：US18252671
申请日：2021-11-16
发明人： Keiji KAWAJIRI , Naoki MUTOU , Hironori MOTOMITSU , Michiya WATANABE , Yuji YAMAGISHI , Yasuhiro NISHIMURA
摘要： A multilayer varistor includes a sintered body, a first external electrode, a second external electrode, a first internal electrode, a second internal electrode, and a high-resistivity portion. The first internal electrode is provided inside the sintered body and electrically connected to the first external electrode. The second internal electrode is provided inside the sintered body and electrically connected to the second external electrode. The high-resistivity portion includes: a surface high-resistivity portion provided to cover a surface of the sintered body; and an inner high-resistivity portion extended inward from the surface high-resistivity portion inside the sintered body.
-
公开(公告)号：US20230368949A1
公开(公告)日：2023-11-16
申请号：US18248190
申请日：2021-09-22
申请人： ROHM CO., LTD.
发明人： Takuya MAEKAWA
摘要： A chip resistor includes a substrate, a first electrode, a second electrode, a first resistor body, a second resistor body, and a connection electrode. The substrate includes a first primary surface. The first electrode includes a first terminal electrode and a first auxiliary electrode. The second electrode includes a second terminal electrode and a second auxiliary electrode. The first auxiliary electrode has a larger area than the first terminal electrode and the second auxiliary electrode has a larger area than the second terminal electrode, in plan view of the first primary surface of the substrate.
-
公开(公告)号：US20230317372A1
公开(公告)日：2023-10-05
申请号：US18124015
申请日：2023-03-21
发明人： Yukie WATANABE
摘要： In a multilayer ceramic electronic component, a first auxiliary electrode layer spaced away from a second internal electrode layer and exposed to a first end surface is on a same plane as a ceramic layer on which the second internal electrode layer is located, a second auxiliary electrode layer spaced away from a first internal electrode layer and exposed to a second end surface is on a same plane as the ceramic layer on which the first internal electrode layer is located, a first via conductor is at a central portion in a width direction of the first internal electrode layer and the first auxiliary electrode layer and exposed to the first end surface, and a second via conductor is at a central portion in a width direction of the second internal electrode layer and the second auxiliary electrode layer and exposed to the second end surface.
-
公开(公告)号：US20230207163A1
公开(公告)日：2023-06-29
申请号：US18065308
申请日：2022-12-13
发明人： Michiya WATANABE
摘要： A sintered body has a first end face and a second end face opposite to each other in a first direction and a first side face and a second side face opposite to each other in a second direction. A first end face electrode is disposed on the first end face except for end portions of the first end face in the second direction. A second end face electrode is disposed on the second end face except for end portions of the second end face in the second direction. A first side face electrode is disposed on the first side face except for end portions of the first side face in the first direction. A second side face electrode is disposed on the second side face except for end portions of the second side face in the first direction.
-
公开(公告)号：US20220254551A1
公开(公告)日：2022-08-11
申请号：US17730543
申请日：2022-04-27
申请人： SUNCALL CORPORATION
发明人： Yuu Moriyama , Kenji Murakami , Akio Mugishima
摘要： A shunt resistor having improved temperature characteristics has a resistive body, a pair of base materials integrally formed on the resistive body across the resistive body, and measurement terminals fixed onto the base materials. The base materials have a plurality of cutout portions along a longitudinal direction of the base materials, wherein the plurality of cutout portions do not communicate with each other and are provided in a stepped manner.
-
公开(公告)号：US20200154571A1
公开(公告)日：2020-05-14
申请号：US16744569
申请日：2020-01-16
申请人： TDK CORPORATION
发明人： Naoyoshi YOSHIDA , Kouki YAMADA , Hisashi AIBA , Kazuto TAKEYA , Hiroya NAKAMURA
IPC分类号： H05K1/18 , H01G4/232 , H01C7/00 , H01C7/04 , H01C1/148 , H01C7/18 , H01G4/30 , H01G2/06 , H01G4/005
摘要： An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.
-
公开(公告)号：US10446303B2
公开(公告)日：2019-10-15
申请号：US16323151
申请日：2017-06-23
申请人： KOA CORPORATION
发明人： Yasuo Mizouchi , Ringo Kumagai , Kazunari Nebashi
摘要： A single or multiple cutters are pressed against end surfaces of a resistive element so as to form a plurality of notches in rims of the end surfaces. At this time, notches are formed such that notch depth at the end surfaces of the resistive element toward the axis center is smaller than notch length from the end surfaces of the resistive element to the axis. This allows easy cutting and removal of the resistance wire at the resistive element ends of a coil resistor, etc., and prevention of fraying of a wound wire at the resistive element ends.
-
公开(公告)号：US10438729B2
公开(公告)日：2019-10-08
申请号：US16181006
申请日：2018-11-05
发明人： Todd L. Wyatt , Darin W. Glenn
摘要： Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of upper heat dissipation elements. The plurality of heat dissipation elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of heat dissipation elements and a surface of the resistive element. Electrode layers are provided on a bottom surface of the resistive element. Solderable layers form side surfaces of the resistor and assist in thermally coupling the heat dissipation elements, the resistor and the electrode layers.
-
-
-
-
-
-
-
-
-
搜索结果
409 条记录 (耗时 0.022 秒)
