公开(公告)号：US20150028992A1

公开(公告)日：2015-01-29

申请号：US14514738

申请日：2014-10-15

Applicant: TDK Corporation

Inventor： Yo SAITO ,  Kouki YAMADA ,  Daisuke TSUCHIDA

IPC: H01C7/00 ,  H01C7/02 ,  H01C17/00 ,  H01C7/04

CPC classification number: H01C7/008 ,  H01C1/1413 ,  H01C7/023 ,  H01C7/04 ,  H01C7/043 ,  H01C17/00 ,  H01C17/006 ,  Y10T29/49085

Abstract: A chip thermistor 1 has a thermistor portion 7 comprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions 9, 9 comprised of a composite material of Ag—Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion 7 so as to sandwich in the thermistor portion 7 between the composite portions 9, 9; and external electrodes 5, 5 connected to the pair of composite portions 9, 9, respectively. In this manner, the pair of composite portions 9, 9 are used as bulk electrodes and, for this reason, the resistance of the chip thermistor 1 can be adjusted mainly with consideration to the resistance in the thermistor portion 7, without need for much consideration to the distance between the external electrodes 5, 5 and other factors.

Abstract translation: 片式热敏电阻1具有热敏电阻部7，其由含有Mn，Ni，Co的各种金属氧化物的陶瓷材料构成，作为主要成分; 由Ag-Pd的复合材料和Mn，Ni和Co的各种金属氧化物构成的一对复合部分9,9，并且布置在热敏电阻部分7的两侧，以夹在热敏电阻部分7之间 复合部分9,9; 以及分别与一对复合部9,9连接的外部电极5,5。 以这种方式，一对复合部分9,9被用作体电极，为此，可以主要考虑到热敏电阻部分7中的电阻来调整芯片热敏电阻1的电阻，而不需要太多考虑 到外部电极5,5之间的距离等因素。

公开(公告)号：US20190098761A1

公开(公告)日：2019-03-28

申请号：US16134733

申请日：2018-09-18

Applicant: TDK CORPORATION

Inventor： Naoyoshi YOSHIDA ,  Kouki YAMADA ,  Hisashi AIBA ,  Kazuto TAKEYA ,  Hiroya NAKAMURA

IPC: H05K1/18 ,  H01G4/005 ,  H01G4/30 ,  H01G4/12 ,  H01G2/06

CPC classification number: H05K1/181 ,  H01C1/148 ,  H01C7/008 ,  H01C7/041 ,  H01C7/18 ,  H01G2/06 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0201

Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

公开(公告)号：US20200154571A1

公开(公告)日：2020-05-14

申请号：US16744569

申请日：2020-01-16

Applicant: TDK CORPORATION

Inventor： Naoyoshi YOSHIDA ,  Kouki YAMADA ,  Hisashi AIBA ,  Kazuto TAKEYA ,  Hiroya NAKAMURA

IPC: H05K1/18 ,  H01G4/232 ,  H01C7/00 ,  H01C7/04 ,  H01C1/148 ,  H01C7/18 ,  H01G4/30 ,  H01G2/06 ,  H01G4/005

Abstract: An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

公开(公告)号：US20140125448A1

公开(公告)日：2014-05-08

申请号：US14061238

申请日：2013-10-23

Applicant: TDK CORPORATION

Inventor： Daisuke TSUCHIDA ,  Yo SAITO ,  Kouki YAMADA

IPC: H01C7/00

CPC classification number: H01C7/008 ,  H01C1/148 ,  H01C17/006 ,  H01C17/283 ,  H01G4/2325

Abstract: A chip thermistor comprises a thermistor element body and a pair of outer electrodes. The thermistor element body has a pair of end faces opposing each other and a main face connecting the end faces to each other. The pair of outer electrodes are arranged on the pair of end faces, respectively. The pair of outer electrodes have a width in a direction intersecting the opposing direction of the pair of end faces made narrower with distance from the thermistor element body.

Abstract translation: 片式热敏电阻包括热敏电阻元件本体和一对外电极。 热敏电阻元件主体具有彼此相对的一对端面和将端面彼此连接的主面。 一对外电极分别设置在一对端面上。 一对外部电极在与热敏电阻元件主体的距离变窄的方向上与所述一对端面的相对方向相交的方向具有宽度。