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公开(公告)号：US20240103368A1
公开(公告)日：2024-03-28
申请号：US18262451
申请日：2022-01-31
CPC分类号： G03F7/032 , G03F7/0043 , G03F7/0295
摘要： A negative photosensitive composition for forming a top plate portion of a hollow structure which contains an epoxy group-containing compound, a cationic polymerization initiator, a polyfunctional (meth)acrylate compound, and a photoradical polymerization initiator.
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公开(公告)号：US11680040B2
公开(公告)日：2023-06-20
申请号：US16978557
申请日：2019-10-11
申请人： LG CHEM, LTD.
发明人： Hyunmin Park , Minyoung Lim
IPC分类号： C07C309/12 , C07C323/61 , C07C323/62 , C07C381/12 , G03F7/004 , G03F7/032 , G03F1/42 , C08F32/08
CPC分类号： C07C309/12 , C07C323/62 , C07C381/12 , C08F32/08 , G03F1/42 , G03F7/0045 , G03F7/032 , C07C2602/42 , C07C2603/74
摘要： The present specification provides a compound, a photoresist composition comprising the same, a photoresist pattern comprising the same, and a method for preparing a photoresist pattern.
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公开(公告)号：US11675266B2
公开(公告)日：2023-06-13
申请号：US17481961
申请日：2021-09-22
发明人： Yao-Jheng Huang , Te-Yi Chang , Chin-Hua Chang , Ming-Tzung Wu , Yu-Ying Hsu
IPC分类号： C07C309/76 , G03F7/031 , G03F7/032
CPC分类号： G03F7/031 , C07C309/76 , G03F7/032 , C07C2603/24
摘要： A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of
The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.-
公开(公告)号：US11209582B2
公开(公告)日：2021-12-28
申请号：US16108290
申请日：2018-08-22
申请人： FUJIFILM Corporation
发明人： Kyohei Arayama , Takuya Tsuruta , Yuki Hirai , Kazutaka Takahashi , Tokihiko Matsumura , Suguru Samejima
IPC分类号： G02B5/20 , G02B5/22 , C08F222/28 , C09B67/22 , G03F7/032 , G03F7/00 , G03F7/028 , C08F290/12 , G02F1/1335 , H01L27/146
摘要： Provided are a composition that has excellent pigment dispersibility without affecting the color of a pigment in a visible range, a curable composition, a cured film, a near infrared cut filter, an infrared transmitting filter; a solid image pickup element, an infrared sensor, and a camera module. The composition includes: a pigment; a pigment derivative that includes a compound represented by Formula (1); and a solvent, in which R1 and R2 represent an aryl group or the like, R3 to R6 represent a cyano group, a heteroaryl group, or the like, R7 and R8 each independently represent —BR9R10 or the like, R9 and R10 each independently represent a hydrogen atom, a halogen atom, an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, or a heteroaryloxy group, L represents a single bond or a linking group, X represents an acidic group or the like, m represents an integer of 1 to 10, and n represents an integer of 1 to 10.
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公开(公告)号：US11086219B2
公开(公告)日：2021-08-10
申请号：US16075864
申请日：2017-03-15
发明人： Yugo Tanigaki , Daisuke Sakii , Satoshi Kamemoto
IPC分类号： G03F7/027 , G03F7/032 , G03F7/037 , H01L51/50 , G03F7/075 , G03F7/105 , G03F7/00 , H01L27/32 , G03F7/004 , H05B33/22 , H05K3/28
摘要： To provide a negative-type photosensitive resin composition that is highly sensitive and capable of formation of a low-taper pattern shape and that is capable of providing a cured film that is excellent in heat resistance. A negative-type photosensitive resin composition contains an (A) alkali-soluble resin, a (B) radical polymerizable compound, and a (C) photo initiator, the negative-type photosensitive resin composition being characterized in that the (A) alkali-soluble resin contains one or more species of resins selected from a (A-1) polyimide, a (A-2) polybenzoxazole, a (A-3) polyimide precursor, a (A-4) polybenzoxazole precursor, a (A-5) polysiloxane, and a (A-6) cardo based resin, and that the (B) radical polymerizable compound contains a compound having five ethylenic unsaturated bond groups in a (B-1) molecule, in an amount within the range of 51 to 99 mass %.
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公开(公告)号：US11016385B2
公开(公告)日：2021-05-25
申请号：US16224812
申请日：2018-12-19
发明人： Yi-Chi Yang , Shou-Yi Ho , Kuo-Chan Chiou
IPC分类号： G03F7/027 , G03F7/033 , G03F7/085 , G03F7/004 , C09J4/00 , C09J165/04 , G03F7/032 , G03F7/021 , C08K3/38 , C08K3/28 , C08F16/32 , C08G61/04 , C08K3/14 , C08K3/22
摘要： The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition.
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公开(公告)号：US20210017127A1
公开(公告)日：2021-01-21
申请号：US16978557
申请日：2019-10-11
申请人： LG CHEM, LTD.
发明人： Hyunmin PARK , Minyoung LIM
IPC分类号： C07C309/12 , C07C381/12 , G03F7/004 , G03F1/42 , C07C323/62 , C08F32/08 , G03F7/032
摘要： The present specification provides a compound, a photoresist composition comprising the same, a photoresist pattern comprising the same, and a method for preparing a photoresist pattern.
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公开(公告)号：US10824072B2
公开(公告)日：2020-11-03
申请号：US16064092
申请日：2016-12-19
发明人： Thomas Telser , Matthias Beyer , Daniel Fleischer
摘要： The invention relates to a method for generative production of relief printing plates, wherein a support with a polymeric substrate layer and a laser-ablatable mask layer is provided, the polymeric substrate layer containing a first binder. A mask with openings corresponding to pixels is produced by imagewise laser ablation of the mask layer. A liquid containing a reactive monomer is then applied over the surface of the mask-covered polymeric substrate layer, and the liquid or the reactive monomer diffuses through the openings of the mask into the polymeric substrate layer for a defined exposure time so as to form a relief. The excess liquid or the excess monomer and optionally the mask are removed from the surface, and the resulting relief is fixed by crosslinking.
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公开(公告)号：US10663861B2
公开(公告)日：2020-05-26
申请号：US15985128
申请日：2018-05-21
IPC分类号： G03F7/038 , G03F7/032 , G03F7/00 , G06F3/044 , C08G18/00 , G03F7/004 , G03F7/20 , G03F7/32 , C08F220/18 , G03F7/031 , G03F7/16 , G06F3/041
摘要： The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 μm or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator.
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公开(公告)号：US10578967B2
公开(公告)日：2020-03-03
申请号：US15580572
申请日：2016-10-19
申请人： LG CHEM, LTD.
发明人： Dongchang Choi , Kyung Soo Choi , Jung Woo Kim , Hae Jung Kim , Guntee Kim
IPC分类号： G03F7/027 , G03F7/031 , G03F7/032 , G03F7/038 , H01L51/52 , G03F7/004 , G03F7/033 , H01L27/32 , G03F7/00 , G03F7/028
摘要： The present application relates to a negative type photosensitive resin composition including a compound of Chemical Formula 1, an alkali soluble resin binder, a polyfunctional monomer, a colorant, a photoinitiator, and a solvent, and a display apparatus including a black bank formed by using the same.
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