公开(公告)号：US20240361544A1

公开(公告)日：2024-10-31

申请号：US18291134

申请日：2022-07-05

申请人： ALTICE LABS, S.A.

发明人： Cláudio Emanuel GOMES FERREIRINHO LIMA RODRIGUES ,  Paulo Jorge DA COSTA MÃO CHEIA ,  Joaquim Fernando VALE E SERRA ,  Alfonso Carlos ANTERO MIRANDA FIGUEIREDO ,  Tiago Manuel CAMPOS ,  Luis Miguel AMARAL HENRIQUES

IPC分类号： G02B6/42 ,  H04B10/50 ,  H04Q11/00

CPC分类号： G02B6/4246 ,  G02B6/4261 ,  G02B6/4281 ,  H04B10/503 ,  H04Q11/0067

摘要： The present invention relates to a dual XGS-PON Small Form-Factor Pluggable Plus optical module, projected to provide connection to two SC optical fiber connectors, and to be incorporated in any state of the art SFP plus transceiver host to allow double XGS-PON-OLT channels. The module comprises a case housing a specific set of technical elements such as bidirectional optical subassemblies, high-speed electrical interface, and all the necessary electronic circuits, printed circuit board and flex-printed circuit board to ensure proper assembly and electronic performance of all elements.

公开(公告)号：US20240361542A1

公开(公告)日：2024-10-31

申请号：US18291295

申请日：2022-07-13

申请人： JENOPTIK Optical Systems GmbH

发明人： Christian KARRAS ,  Thomas KADEN ,  Tobias GNAUSCH ,  Robert BUETTNER ,  Armin GRUNDMANN

IPC分类号： G02B6/42

CPC分类号： G02B6/4214

摘要： An optical module for modifying a light beam, wherein the optical module is made of a single-piece solid body material and has a passage surface for receiving the light beam. Furthermore, the optical module comprises a beam deflecting region lying opposite the passage surface for deflecting the light beam, wherein the beam deflecting region is designed as a curved region on the exterior of the optical module, in particular so as to have a hollow mirror function, a pass-through surface for outputting the light beam deflected by the beam deflecting region and a beam shaping region that is designed to shape the light beam and additionally or alternatively thereto the deflected light beam such that the light beam has a beam profile a with homogeneous intensity distribution over a specified range.

公开(公告)号：US12130485B1

公开(公告)日：2024-10-29

申请号：US18610431

申请日：2024-03-20

申请人： Celestial AI Inc.

发明人： Philip Winterbottom ,  David Lazovsky ,  Ankur Aggarwal ,  Martinus Bos ,  Subal Sahni

IPC分类号： G02B6/42 ,  G02F1/015

CPC分类号： G02B6/4295 ,  G02B6/4246 ,  G02B6/428 ,  G02F1/0157 ,  G02B6/4245

摘要： An implementation provides a package that includes a first die including a bridging element, an analog/mixed-signal (AMS) die, and a general die. The first die includes: a first photonic transceiver portion, a first die first interconnect region, and an optical interface (OI). The AMS die includes a second photonic transceiver portion, an AMS die first interconnect region on a first surface of the AMS die electrically and physically coupled with the first die first interconnect region; and an AMS die second interconnect region on a second surface of the AMS die. The general die includes a third photonic transceiver portion, and a general die first interconnect region electrically and physically coupled with the second photonic transceiver portion.

公开(公告)号：US20240353631A1

公开(公告)日：2024-10-24

申请号：US18761456

申请日：2024-07-02

申请人： Intel Corporation

发明人： Vivek RAGHUNATHAN ,  Myung Jin YIM

IPC分类号： G02B6/42 ,  G02B6/122 ,  G02B6/132 ,  H01L25/16

CPC分类号： G02B6/4206 ,  G02B6/122 ,  G02B6/132 ,  G02B6/42 ,  G02B6/4212 ,  G02B6/4225 ,  G02B6/428 ,  H01L25/167

摘要： Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.

公开(公告)号：US12123767B2

公开(公告)日：2024-10-22

申请号：US17832774

申请日：2022-06-06

申请人： Qisda Corporation

发明人： Che-Yi Lai ,  Chun-Ming Shen ,  Chin-Kuei Lee ,  Chih-Chia Chen

IPC分类号： G01J1/04 ,  G01J1/42 ,  G02B6/42

CPC分类号： G01J1/0422 ,  G01J1/4204 ,  G02B6/4203

摘要： A light sensor includes an optoelectronic device and a light guide element. The light guide element has a first light incident surface and a light exit surface, so as to allow an incident light to enter the light guide element from the first light incident surface and then exit to the optoelectronic device from the light exit surface; wherein at least one of the light incident surface and the light exit surface has a single curved surface.

公开(公告)号：US20240345347A1

公开(公告)日：2024-10-17

申请号：US18293561

申请日：2022-06-23

申请人： AFL Telecommunications LLC

发明人： Bin Liu ,  Dale Eddy ,  Magdy Sadek ,  Scott Prescott ,  Dan Farley

IPC分类号： G02B6/42 ,  G01M11/00

CPC分类号： G02B6/4289 ,  G01M11/35 ,  G02B6/4206 ,  G02B6/4286

摘要： An optical fiber identifier apparatus and system are provided. The apparatus includes a housing forming a pathway at which an optical fiber is positionable. The housing forms a tip end that forms a bend of the optical fiber at the pathway. At least two lenses are positioned parallel to one another. Each lens defines an optical axis extended through the bend of the optical fiber and perpendicular to a longitudinal axis of the respective lens. A photo detector device is positioned to receive a beam of light from the optical fiber via the one or more lenses.

公开(公告)号：US20240345345A1

公开(公告)日：2024-10-17

申请号：US18757571

申请日：2024-06-28

申请人： Intel Corporation

发明人： Debendra Das Sharma

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4274 ,  G02B6/43

摘要： For example, an electronic system may include interconnect circuitry to communicate over an electrical interconnect; and a Physical layer (PHY) controller configured to access a plurality of optical-capability registers to identify optical-training control information and optical-capability information. For example, the optical-training control information may include a start-training bit. For example, based on a determination that the start-training bit is set to a predefined value, the PHY controller may initiate an optical-based link training procedure via the electrical interconnect to train a link between the electronic system and a partner electronic system over a redriver-based optical interconnect. For example, the optical-based link training procedure may be based on the optical-capability information.

公开(公告)号：US20240345342A1

公开(公告)日：2024-10-17

申请号：US18133011

申请日：2023-04-11

申请人： Ciena Corporation

发明人： Peter Ajersch ,  Trevor Meunier ,  Mitchell O’Leary

IPC分类号： G02B6/42

CPC分类号： G02B6/4269 ,  G02B6/4277

摘要： An optical system including: a faceplate including a receptacle adapted to receive a pluggable optical module; and one or more of: a thermal pad disposed adjacent to at least one interior side of the receptacle, wherein the thermal pad is adapted to be in thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from a nose of the pluggable optical module to the faceplate; and a heat sink disposed at an interior side of the receptacle, wherein the heatsink is adapted to be in physical contact and thermal communication with the pluggable optical module when the pluggable optical module is received within the receptacle and conduct heat from the nose of the pluggable optical module to an air flow present behind the faceplate.

公开(公告)号：US20240345341A1

公开(公告)日：2024-10-17

申请号：US18135076

申请日：2023-04-14

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Jung Jui KANG ,  Shih-Yuan SUN ,  Chiu-Wen LEE ,  Chang Chi LEE ,  Chun-Yen TING ,  Hung-Chun KUO

IPC分类号： G02B6/42 ,  G02B6/43

CPC分类号： G02B6/4267 ,  G02B6/4257 ,  G02B6/43

摘要： A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

公开(公告)号：US20240345338A1

公开(公告)日：2024-10-17

申请号：US18298685

申请日：2023-04-11

申请人： Wisconsin Alumni Research Foundation

发明人： Jiamian Hu ,  Shihao Zhuang ,  Chang-Beom Eom

IPC分类号： G02B6/42 ,  H04B10/50

CPC分类号： G02B6/4215 ,  G02B6/4283 ,  H04B10/505

摘要： Optoelectronic transducers that convert a femtosecond (fs)-timescale laser pulse into an a.c. electrical current pulse with an extremely high frequency and a high quality factor (Q) are provided. Both the frequency and amplitude of the a.c. electrical current pulse can be dynamically tuned by the application of a varying bias magnetic field. The optoelectronic transducers are based on a trilayered freestanding membrane that functions as both an acoustic cavity and a magnon cavity. The freestanding membrane includes an electrical conductor layer, a magnetic insulator layer, and a dielectric layer arranged in a vertical stack.