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公开(公告)号：US20250070880A1
公开(公告)日：2025-02-27
申请号：US18928686
申请日：2024-10-28
Applicant: Marvell Asia Pte Ltd
Inventor： Ding Liang , Mark Patterson , Roberto Coccioli , Radhakrishnan L. Nagarajan
Abstract: An optical transceiver includes a silicon photonics substrate and multiple devices. The devices are configured to process optical signals propagating to and from the optical transceiver, and to perform at least one of an optical-to-electrical conversion of received optical signals to incoming electric signals and an electrical-to-optical conversion of outgoing electric signals to transmitted optical signals. The devices are each fabricated to include respectively a package substrate configured according to one of multiple different package substrate mounting technologies. Each package substrate among the multiple devices is mounted on the silicon photonics substrate according to mounting requirements of the respective package substrate mounting technology of that package substrate. At least two of the package substrates are mounted according to the mounting requirements of different package substrate mounting technologies.
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公开(公告)号：US12237871B2
公开(公告)日：2025-02-25
申请号：US18190931
申请日：2023-03-27
Applicant: Lightmatter, Inc.
Inventor： Mykhailo Tymchenko , Bradford Turcott , Robert Turner , Binoy Shah , Shashank Gupta , James Carr , Ajay Joshi , Nicholas C. Harris , Darius Bunandar
IPC: H04B10/50 , G02B6/124 , G02B6/13 , G02B6/42 , G02B6/43 , H04B10/079 , H04B10/40 , H04B10/70 , H04B10/80 , H04J14/02
Abstract: Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.
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公开(公告)号：US12235496B2
公开(公告)日：2025-02-25
申请号：US18614520
申请日：2024-03-22
Applicant: RAM Photonics Industrial, LLC
Inventor： John R. Marciante
Abstract: A method of stabilizing a fiber Bragg grating (FBG) disposed in a thermomechanical housing included performing an initialization process including measuring a transmission ratio at a plurality of FBG temperatures between an initial and final temperature, determining a maximum transmission ratio, and changing the temperature of the FBG until the transmission ratio equals a target transmission ratio. The method also includes performing an operation process including (a) measuring the transmission ratio, (b) adjusting the FBG temperature to align the measured transmission ratio with the predetermined fraction of the maximum transmission ratio, and (c) iteratively performing (a) and (b).
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公开(公告)号：US20250063851A1
公开(公告)日：2025-02-20
申请号：US18932611
申请日：2024-10-30
Applicant: Ayar Labs, Inc.
Inventor： Dries Vercruysse , John M. Fini
IPC: H01L31/0232 , G02B6/42 , H01L31/109
Abstract: A photodetector includes a photodiode that has a germanium junction formed between an n-doped region and a p-doped region. The germanium junction is formed to have an input interface at a light input end of the germanium junction. The input interface has a substantially flat shape or a convex-faceted shape. The photodetector also includes an input waveguide connected to the input interface of the germanium junction. The input waveguide has a substantially linear shape along a lengthwise centerline of the input waveguide. The input waveguide is oriented so that the lengthwise centerline of the input waveguide is positioned at a non-zero angle relative to input interface of the germanium junction.
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5.发明申请公开(公告)号：US20250062589A1
公开(公告)日：2025-02-20
申请号：US18806608
申请日：2024-08-15
Applicant: YALE UNIVERSITY
Inventor： Hong Tang , Yubo Wang , Yu Guo , Jorge Holguin-Lerma
IPC: H01S3/16 , G02B6/42 , H01S3/08 , H01S3/0941
Abstract: Provided herein are a method of preparing a Titanium:Sapphire (Ti:Sa) wafer and a photonic circuit integrated (PIC) Titanium:Sapphire (Ti:Sa) laser. The method includes depositing a titanium layer on a top surface of a first sapphire substrate; positioning a second sapphire substrate on the titanium layer, forming a face-to-face configuration with the titanium layer between the first and second sapphire substrates; annealing the first and second sapphire substrates in the face-to-face configuration, forming an annealed substrate; and polishing the annealed substrate, forming a polished substrate. The PIC-Ti:Sa laser includes a substrate; a waveguide formed on the substrate, the waveguide including a microring portion; a Ti:Sa layer formed over the microring portion of the waveguide, the Ti:Sa layer and the microring portion of the waveguide forming a microring cavity; and a laser source coupled to the waveguide. Also provided herein are methods of forming a photonic circuit integrated mode-locked Ti:Sa laser.
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Patent Agency Ranking
公开(公告)号：US20250060545A1
公开(公告)日：2025-02-20
申请号：US18449728
申请日：2023-08-15
Inventor： Venkatesh Seetharam , Mike John Brosnan
IPC: G02B6/42
Abstract: Method and structure for shielding electromagnetic interference in photonic integrated circuits (PIC) disposed on electronic integrated circuits (EIC). The invention addresses the electromagnetic interference problem by employing vias through the PIC's bulk silicon substrate. The invention also uses a conductive layer covering the backside of the PIC bulk silicon substrate on which the metal heat spreader can be placed. Now, the vias can make electrical contact from the reference net formed for PIC's light transmission component on one or more metal layers of the PIC to the conductive layer on the backside of the PIC. Such an arrangement allows for robust electrical connection and allows the metal heat spreader to act as robust ground thus terminating the electromagnetic fields.
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公开(公告)号：US20250060516A1
公开(公告)日：2025-02-20
申请号：US18451223
申请日：2023-08-17
Applicant: Intel Corporation
Inventor： Nicholas Psaila
Abstract: Photonic devices, packages, and systems with sub-surface compound microlenses are disclosed. An example microlens structure includes a glass core and a microlens stack embedded in the glass core, the stack comprising a plurality of regions stacked a direction of propagation of light that is to be manipulated by the microlens structure, wherein each region is a region of a substantially uniform refractive index that is different from the refractive index of the glass core. Such a stack may be referred to as a “sub-surface compound microlens,” where the term “sub-surface” is indicative of the fact that the stack may be below all surfaces of the glass core (i.e., is embedded in the glass core) and the term “compound” is indicative of the fact that the stack is a compound arrangement of multiple regions (e.g., each region is an individual microlens).
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公开(公告)号：US12228778B2
公开(公告)日：2025-02-18
申请号：US17866400
申请日：2022-07-15
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Jr-Wei Lin , Mei-Ju Lu
Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.
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公开(公告)号：US12228777B2
公开(公告)日：2025-02-18
申请号：US18079973
申请日：2022-12-13
Inventor： Joong-Seon Choe , Duk Jun Kim , Chun Ju Youn
IPC: G02B6/42
Abstract: An optical alignment device according to an embodiment of the inventive concept includes an optical alignment plate having a first hole and at least one second hole, in which the first hole and the second hole pass through the optical alignment plate, and an optical detection element disposed on the optical alignment plate. Here, the optical detection element includes a substrate having a first surface and a second surface, which face each other, a lens disposed on the first surface, and an optical sensor disposed on the second surface, and the optical detection element vertically overlaps the first hole and the second hole. The lens is exposed to the outside by the first hole, and the second hole is connected with a vacuum suction unit to fix the optical detection element to the optical alignment plate.
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公开(公告)号：US20250055260A1
公开(公告)日：2025-02-13
申请号：US18806648
申请日：2024-08-15
Applicant: DustPhotonics
Inventor： Yoel Chetrit
Abstract: A method for aligning a laser unit to a waveguide unit, the method may comprise placing the laser unit in a tested position in which the laser unit faces the waveguide unit; supplying light, via a coupler of the waveguide unit, to an alignment waveguide of the waveguide unit; receiving light reflected from the alignment waveguide; wherein when aligned to the waveguide unit, an alignment unit of the laser unit reflects toward the alignment waveguide light having a spectral signature of the alignment unit; and wherein when misaligned to the waveguide unit, the laser unit is configured to reflect light without the spectral signature of the alignment unit towards the alignment waveguide; determining whether the light reflected from the alignment waveguide comprises the spectral signature associated with the alignment unit of the laser unit; wherein the alignment waveguide exhibits a frequency selective response that has the spectral signature; wherein the frequency selective response differs from a reflection from a mirror, wherein other frequencies than the frequency selective response are not returned by the mirror towards the alignment unit and then to the waveguide unit or at least are not returned by the mirror towards the alignment unit and then to the waveguide unit, without being significantly attenuated, thereby reducing or eliminating the reflected radiation from the mirror towards the waveguide unit; and estimating whether the laser unit is aligned to the waveguide unit based on the determining.
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