LOW-LOSS PHASE SHIFTERS
    1.
    发明申请

    公开(公告)号:US20250068003A1

    公开(公告)日:2025-02-27

    申请号:US18809699

    申请日:2024-08-20

    Abstract: Aspects of the present application relate to an optical phase shifter including a first waveguide defined in a first semiconductor layer, the first waveguide comprising a single-mode portion, a multi-mode portion, and a tapered portion coupling the single-mode portion to the multi-mode portion. A second waveguide is defined in a second semiconductor layer, the second waveguide having a tapered portion and a tip, wherein the tapered portion of the second waveguide overlaps with the tapered portion of the first waveguide. For tuning the phase change, a first electrically resistive path, defined at least partially in the first semiconductor layer, is included. The first electrically resistive path intersects the multi-mode portion of the first waveguide.

    PHOTONIC COMMUNICATION PLATFORM, PACKAGES AND RELATED FABRICATION

    公开(公告)号:US20230314711A1

    公开(公告)日:2023-10-05

    申请号:US18190926

    申请日:2023-03-27

    CPC classification number: G02B6/13 G02B6/124

    Abstract: Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.

    Linear photonic processors and related methods

    公开(公告)号:US11609742B2

    公开(公告)日:2023-03-21

    申请号:US17398384

    申请日:2021-08-10

    Abstract: Photonic processors are described. The photonic processors described herein are configured to perform matrix-matrix (e.g., matrix-vector) multiplication. Some embodiments relate to photonic processors arranged according to a dual-rail architecture, in which numeric values are encoded in the difference between a pair optical signals (e.g., in the difference between the powers of the optical signals). Relative to other architectures, these photonic processors exhibit increased immunity to noise. Some embodiments relate to photonic processors including modulatable detector-based multipliers. Modulatable detectors are detectors designed so that the photocurrent can be modulated according to an electrical control signal. Photonic processors designed using modulatable detector-based multipliers are significantly more compact than other types of photonic processors.

    FIBER-COUPLED LASER LIGHT SOURCE
    6.
    发明申请

    公开(公告)号:US20230067275A1

    公开(公告)日:2023-03-02

    申请号:US17899277

    申请日:2022-08-30

    Abstract: Described herein are photonic sources and related system architectures that can satisfy the optical power requirements of large photonic accelerators. Some embodiments relate to a computer comprising a photonic accelerator configured to perform matrix multiplication; a fiber array optically coupled to the photonic accelerator; and a photonic source optically coupled to the fiber array. The photonic source comprising a laser array comprising a plurality of monolithically co-integrated lasers, and a coupling lens array comprising a plurality of monolithically co-integrated lenses, the coupling lens array optically coupling the laser array to the fiber array. The laser array is configured to output between 0.1 W and 10 W of optical power.

    PHOTONICS STABILIZATION CIRCUITRY

    公开(公告)号:US20220317378A1

    公开(公告)日:2022-10-06

    申请号:US17843939

    申请日:2022-06-17

    Abstract: Methods and apparatus for tuning a photonics-based component. An opto-electrical detector is configured to output an electrical signal based on a measurement of light intensity of the photonics-based component, the light intensity being proportional to an amount of detuning of the photonics-based component. Analog-to-digital conversion (ADC) circuitry is configured to output a digital signal based on the electrical signal output from the opto-electrical detector. Feedback control circuitry is configured to tune the photonics-based component based, at least in part, on the digital signal output from the ADC circuitry.

    Linear photonic processors and related methods

    公开(公告)号:US11169780B2

    公开(公告)日:2021-11-09

    申请号:US17101415

    申请日:2020-11-23

    Abstract: Photonic processors are described. The photonic processors described herein are configured to perform matrix-matrix (e.g., matrix-vector) multiplication. Some embodiments relate to photonic processors arranged according to a dual-rail architecture, in which numeric values are encoded in the difference between a pair optical signals (e.g., in the difference between the powers of the optical signals). Relative to other architectures, these photonic processors exhibit increased immunity to noise. Some embodiments relate to photonic processors including modulatable detector-based multipliers. Modulatable detectors are detectors designed so that the photocurrent can be modulated according to an electrical control signal. Photonic processors designed using modulatable detector-based multipliers are significantly more compact than other types of photonic processors.

    OPTICAL COMMUNICATION SUBSTRATE USING GLASS INTERPOSER

    公开(公告)号:US20240353614A1

    公开(公告)日:2024-10-24

    申请号:US18638820

    申请日:2024-04-18

    CPC classification number: G02B6/12002 H04B10/40 H04B10/802 G02B2006/12038

    Abstract: Described herein photonic interconnects based on glass interposers. Glass interposers of the types described herein are used to photonically interconnect multiple smaller photonic integrated circuits (PIC), as opposed to using a single, larger PIC. The typical yield of a glass interposer is significantly higher than the yield of a PIC. This is because glass interposers are passive in nature, while PICs include active photonic elements. Active photonic components (e.g., photonic transceivers and switches) tend to be more susceptible to manufacturing defects than passive photonic components (e.g., waveguides and couplers) because active components require additional manufacturing steps (e.g., ion implantation, sputtering, epitaxial growth, etc.). The approach described herein improves performance because instead of having to slice a large number of continuous reticles from a wafer, one can pick and choose reticles known to have yielded.

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