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公开(公告)号：US20250065429A1
公开(公告)日：2025-02-27
申请号：US18724245
申请日：2022-01-26
Applicant: FUJI CORPORATION
Inventor： Kenji NAKAI
Abstract: A mounting system formed by arranging multiple mounting devices, on which multiple members used in a mounting process of a board are mounted, along a conveyance direction of the board, the mounting system includes: an information acquisition section configured to acquire information including a conveyance status of the board; and a guidance output section configured to, when replenishment of the members is required or is predicted to be required in two or more mounting devices, determine which mounting device is to be preferentially replenished based on the conveyance status of the board and output the determined replenishment guidance.
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公开(公告)号：US20250041958A1
公开(公告)日：2025-02-06
申请号：US18717035
申请日：2022-12-07
Applicant: JABIL INC.
Inventor： Charles Santhakumar , Harpuneet SINGH , Anwar A. MOHAMMED , Michael TORREGROSSA
Abstract: A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.
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公开(公告)号：US12209819B2
公开(公告)日：2025-01-28
申请号：US17831759
申请日：2022-06-03
Applicant: RTX Corporation
Inventor： James Fredric Wiedenhoefer
Abstract: A heat exchanger includes parting sheets and a fin sheet interposed between the parting sheets and corrugated along a first axis to form fins. Each of the fins is segmented to define gaps, which are arranged along a second axis perpendicular to the first axis, and which cooperatively accommodate curvatures of the parting sheets and the fin sheet in a third axis perpendicular to the first and second axes.
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公开(公告)号：US12171066B2
公开(公告)日：2024-12-17
申请号：US17507684
申请日：2021-10-21
Applicant: Pac Tech—Packaging Technologies GmbH
Inventor： Matthias Fettke , Andrej Kolbasow
Abstract: A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.
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公开(公告)号：US12167543B2
公开(公告)日：2024-12-10
申请号：US17447518
申请日：2021-09-13
Applicant: AT&S (Chongqing) Company Limited
Inventor： Ismadi Bin Ismail , Fanyi Chiu
Abstract: A component carrier system with a component carrier, a base solder mask layer formed on a surface of the component carrier, and a top solder mask layer formed on top of a predefined section of the base solder mask. The predefined section of the base solder mask covers a target section of the component carrier.
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Patent Agency Ranking
公开(公告)号：US12157039B1
公开(公告)日：2024-12-03
申请号：US18732424
申请日：2024-06-03
Applicant: Topgolf Callaway Brands Corp.
Inventor： Eric Itokazu , Alex Power , Patrick Davis , Matthew Myers
IPC: A63B53/04 , B23K1/00 , B23K1/008 , B23K35/30 , B23K103/24
Abstract: A golf club head with a mitered joint for joining components of dissimilar materials is disclosed herein. The golf club head has a body with an internal edge defining a recess, and a face component having an internal edge. The face component is disposed over the recess. The internal edge of the body and the internal edge of the face have an angle ranging from 10 degrees to 45 degrees.
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公开(公告)号：US12157038B1
公开(公告)日：2024-12-03
申请号：US18232979
申请日：2023-08-11
Applicant: Topgolf Callaway Brands Corp.
Inventor： Eric Itokazu , Alex Power , Patrick Davis , Matthew Myers
IPC: A63B53/04 , B23K1/00 , B23K1/008 , B23K35/30 , B23K103/24
Abstract: A golf club head with a mitered joint for joining components of dissimilar materials is disclosed herein. The golf club head has a body with an internal edge defining a recess, and a face component having an internal edge. The face component is disposed over the recess. The internal edge of the body and the internal edge of the face have an angle ranging from 10 degrees to 45 degrees.
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公开(公告)号：US12152915B2
公开(公告)日：2024-11-26
申请号：US16709124
申请日：2019-12-10
Applicant: Weston Aerospace Limited
Inventor： Nigel Turner , Paul Hanscombe , Martin Brown , Dean Dobson
IPC: G01D5/241 , B23K1/00 , B23K103/00 , G01M15/14
Abstract: A probe (1, 101) for monitoring a moving engine element and a method of forming a probe (1, 101) for monitoring a moving engine element, the probe (1, 101) comprising: a housing (2, 102) formed of electrically insulating ceramic material; a core (14, 114) formed of electrically insulating ceramic material, the core (14, 114) comprising a front face (16, 116; and a sensing electrode (20, 120) formed of electrically conductive material, the sensing electrode (20, 120) being arranged between the housing (2, 102) and the front face (16, 116) of the core (14, 114) and the housing (2, 102) and the front face (16, 116) of the core (14, 114) being bonded together by the sensing electrode (120).
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公开(公告)号：US12151315B2
公开(公告)日：2024-11-26
申请号：US17908055
申请日：2020-07-01
Applicant: S.S.P. INC.
Inventor： Kyouho Lee
IPC: B23K3/06 , B23K1/00 , B23K1/20 , H01L23/00 , B23K101/40 , B23K101/42
Abstract: A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.
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公开(公告)号：US12151280B2
公开(公告)日：2024-11-26
申请号：US17772648
申请日：2020-10-29
Applicant: Marelli Corporation
Inventor： Masahiro Kato , Takashi Kaneda , Fumihiro Kawashima
Abstract: A heat exchanger includes: flat tubes; a plate attached to the flat tubes; a medium tank configured to form a medium flow path by covering openings of flat tubes; and a reinforcing member to reinforce the openings. The reinforcing member includes a pair of leg portions and a connection portion that connects the leg portions. An insertion amount of the leg portions into the opening is larger than a sum of a gap between the connection portion and an inner surface and a length from the opening to a position corresponding to a brazed portion between the flat tube and the plate, or when a protruding portion protruding in a direction opposite an insertion direction is provided in the connection portion, larger than a sum of a gap between the protruding portion and the inner surface and a length from the opening to the position corresponding to the brazed portion.
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