公开(公告)号：US20250033131A1

公开(公告)日：2025-01-30

申请号：US18717046

申请日：2022-12-07

Applicant: JABIL INC.

Inventor： Charles Santhakumar ,  Harpuneet SINGH ,  Anwar A. MOHAMMED ,  Michael TORREGROSSA

IPC: B23K3/04 ,  B23K3/06 ,  B23K3/08 ,  B23K101/42 ,  F27B9/24 ,  F27B9/40 ,  F27D19/00 ,  G01N21/956 ,  G01N23/18 ,  H05K3/12 ,  H05K3/30 ,  H05K13/04

Abstract: A reflow soldering oven for soldering and/or bonding component leads both electrically and mechanically to pads on a PCB in an SMT manufacturing system. The soldering oven includes at least one thermal infrared camera that generates thermal images of the PCB to provide thermal imaging processing to monitor and correct temperature deviations in real time. The oven generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling and to initiate changes like temperature control or the oven belt-speed monitoring to offer self-correcting capabilities.

公开(公告)号：US20250041958A1

公开(公告)日：2025-02-06

申请号：US18717035

申请日：2022-12-07

Applicant: JABIL INC.

Inventor： Charles Santhakumar ,  Harpuneet SINGH ,  Anwar A. MOHAMMED ,  Michael TORREGROSSA

IPC: B23K1/08 ,  B23K1/00

Abstract: A self-correcting wave soldering machine for soldering a RGB in an SMT manufacturing system. The wave soldering machine includes at least one thermal infrared camera that generates thermal images of the RGB so as to provide thermal imaging processing to monitor, characterize and predict processing temperatures. The wave soldering machine generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling by digitally connecting it to heating and other mechanically controlled systems, such as flux dispensing, conveyor speed and parallelism of the wave soldering machine.