公开(公告)号：US06172997B2

公开(公告)日：2001-01-09

申请号：US09097648

申请日：1998-06-16

申请人： Charles I. Miyake ,  Leonard P. Pearson ,  Jeffrey Pierce

发明人： Charles I. Miyake ,  Leonard P. Pearson ,  Jeffrey Pierce

IPC分类号： H01S5024

CPC分类号： H01S3/09415 ,  H01S3/025 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/07 ,  H01S3/2383

摘要： A method and apparatus for fabricating extremely robust opto-electronic devices on a monolithic support structure is provided. Incorporated into the support structure are registration structures that are used to quickly and accurately align the various components associated with the device, typically eliminating the need for manual component alignment. The registration structures are fabricated using conventional lithographic techniques, offering alignment accuracy of a micrometer or less. Utilizing the registration structures, a gain module is fabricated that is comprised of at least a pump laser, an optical element, and a solid state gain medium. The pump laser is preferably a semiconductor diode laser that pumps the edge of the gain medium, thus eliminating many of the difficulties that arise from end pumping the medium. The optical element, interposed between the pump laser and the gain medium, collimates and/or focuses the emissions from the pump laser onto the laser medium in such a manner as to optimize the efficiency of the module. The gain module may include several pump lasers, thus increasing the achieved output power. The gain module preferably projects through a cutout in a miniature optical bench. The optical bench is comprised of a material with a very low coefficient of thermal expansion, thus providing thermal stability. The surface of the optical bench is metallized, preferably in a pattern of gold pads. Optical components to be attached to the optical bench are metallized as well, thus allowing the components to be soldered into place. The optical bench is used to form various laser systems utilizing the integral gain module.

摘要翻译： 提供了一种用于在整体式支撑结构上制造极其鲁棒的光电器件的方法和装置。 结合到支撑结构中的是用于快速且准确地对准与装置相关联的各种部件的配准结构，通常消除了对手动部件对准的需要。 使用常规光刻技术制造配准结构，提供千分尺或更小的对准精度。 利用对准结构，制造增益模块，该增益模块至少包括泵浦激光器，光学元件和固态增益介质。 泵浦激光器优选是泵浦增益介质的边缘的半导体二极管激光器，从而消除了端部泵送介质所产生的许多困难。 介于泵浦激光器和增益介质之间的光学元件以使得模块的效率最优化的方式将来自泵激光器的发射准直和/或聚焦到激光介质上。 增益模块可以包括几个泵浦激光器，从而增加实现的输出功率。 增益模块优选通过微型光学平台中的切口突出。 光学平台由具有非常低的热膨胀系数的材料组成，从而提供热稳定性。 光学平台的表面被金属化，优选地以金焊盘的图案。 要连接到光学平台的光学部件也被金属化，从而允许部件被焊接到位。 光学台用于形成利用积分增益模块的各种激光系统。

公开(公告)号：US06456635B1

公开(公告)日：2002-09-24

申请号：US09508630

申请日：2000-03-14

申请人： Takehiro Shiomoto ,  Ikuo Kohashi

发明人： Takehiro Shiomoto ,  Ikuo Kohashi

IPC分类号： H01S5024

CPC分类号： G11B7/127 ,  G11B2007/0006 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01S5/02 ,  H01S5/4025 ,  H01S5/4087 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor laser device (100) comprises a first semiconductor laser element (31) and a second semiconductor laser element (32) of different wavelengths, which are mounted on a heat sink block (2) directly or through a sub-mount provided on the heat sink block. The optical axes (A, B) of the semiconductor laser elements are substantially parallel to each other. The first and second semiconductor laser elements (31, 32) are mounted on the heat sink block (2) in such a manner that a relationship of 0≦L≦d1+d2≦160 &mgr;m is satisfied, where d1 is a distance between the optical axis (A) of the first semiconductor laser element (31) and the center axis (O) of a condenser lens (71) arranged in front of the semiconductor laser device (i.e., faced to the emission surfaces of the semiconductor laser elements), d2 is a distance between the optical axis (B) of the second semiconductor laser element (32) and the center axis of the condenser lens, and L is a distance between the optical axes of the first and second semiconductor laser elements.

摘要翻译： 半导体激光器件（100）包括不同波长的第一半导体激光器元件（31）和第二半导体激光器元件（32），其直接或通过设置在散热块（2）上的子安装座 散热块 半导体激光元件的光轴（A，B）基本上彼此平行。 第一和第二半导体激光元件（31,32）以满足0 <= L <= d1 + d2 <=160μm的关系的方式安装在散热块（2）上，其中d1是 第一半导体激光元件（31）的光轴（A）与布置在半导体激光器件前方的聚光透镜（71）的中心轴（O）之间的距离（即，面向半导体激光器的发射表面 激光元件），d2是第二半导体激光元件（32）的光轴（B）与聚光透镜的中心轴之间的距离，L是第一和第二半导体激光元件的光轴之间的距离 。

公开(公告)号：US06178189B1

公开(公告)日：2001-01-23

申请号：US09304441

申请日：1999-05-03

申请人： Swaminathan Srinivasan ,  Rushikesh M. Patel

发明人： Swaminathan Srinivasan ,  Rushikesh M. Patel

IPC分类号： H01S5024

CPC分类号： H01S5/4031 ,  H01S5/0207 ,  H01S5/02256 ,  H01S5/22 ,  H01S5/3201

摘要： Multi-layer, semiconductor devices are configured to reduce stress by the removal of much of the structure which does not actually contribute to device performance. In one embodiment, trough between mesas which define light emitting facets in a laser diode bar are etched well into the substrate to remove all layers of different compositions there. In another embodiment, troughs are also etched in the backside of the substrate of a laser diode structure where the troughs are aligned along axes perpendicular to the axes of the mesas. The removal of stress permits more accurate alignment of the multiple facets along a single axis when the laser bar is bonded to a heat sink. The accurate alignment minimizes the placement constraints on the position of a microlens for achieving maximum power output and coupling efficiency for optical fibers coupled to the microlens.

摘要翻译： 多层半导体器件被配置为通过去除实际上对器件性能没有贡献的结构的大部分来减少应力。 在一个实施例中，在激光二极管条中限定光发射小面的台面之间的槽被很好地蚀刻到衬底中以去除其中不同组成的所有层。 在另一个实施例中，还在激光二极管结构的衬底的背面蚀刻槽，其中槽沿着与台面的轴线垂直的轴线对齐。 当激光条被接合到散热器时，去除应力允许沿着单个轴的多个面的更准确的对准。 准确的对准使得微透镜的位置上的放置约束最小化，以实现耦合到微透镜的光纤的最大功率输出和耦合效率。

公开(公告)号：US06181718B2

公开(公告)日：2001-01-30

申请号：US09003949

申请日：1998-01-08

申请人： Masaki Kobayashi ,  Hiroyuki Asakura ,  Masanori Iida

发明人： Masaki Kobayashi ,  Hiroyuki Asakura ,  Masanori Iida

IPC分类号： H01S5024

CPC分类号： H01S5/02284 ,  H01L24/45 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/1204 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01S5/02276 ,  H01S5/02415 ,  H01S5/0427 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752

摘要： The invention provides a semiconductor laser module with an electronic cooling device prevented from experiencing a lowering of the optical frequency response characteristic level in a band used for public communications. By changing the inductance of the ground line between module package and chip-mounted carrier of the semiconductor laser module, the resonance frequency of a resonance circuit made up by including the ground line is shifted so as to deviate from the frequency band of public communications used by a modulation signal transmitting device.

摘要翻译： 本发明提供一种具有电子冷却装置的半导体激光器模块，防止在用于公共通信的频带中经历光频响应特性水平的降低。 通过改变模块封装和半导体激光器模块的芯片安装载体之间的接地线的电感，通过包括接地线组成的谐振电路的谐振频率被偏移，以偏离所使用的公共通信的频带 通过调制信号发送装置。

公开(公告)号：US06178188B1

公开(公告)日：2001-01-23

申请号：US08988947

申请日：1997-12-11

申请人： Xingliang Jing ,  Pedram A. Leilabady

发明人： Xingliang Jing ,  Pedram A. Leilabady

IPC分类号： H01S5024

CPC分类号： H01S5/02252 ,  H01S3/005 ,  H01S3/0064 ,  H01S3/025 ,  H01S3/0627 ,  H01S3/09415

摘要： A laser assembly including a silicon base and method are provided for assembling lasers on a platform in a reliable, low cost process that is suitable for high volume production. The platform can be a monolithic silicon base which has high thermal conductivity, a low coefficient of thermal expansion, and whose features can be formed with close tolerances in a low cost, reliable manner. Materials with similar coefficients of thermal expansion are used in order to maintain alignment during unexpected heating and cooling. Furthermore, a method is described that substantially eliminates the need for adhesives to bond laser components to a platform. The resultant laser can be very robust, stable, and can provide reliable operation over extended time periods.

摘要翻译： 提供了一种包括硅基和激光组件的激光组件，用于以适合于大批量生产的可靠，低成本的工艺在平台上组装激光器。 该平台可以是具有高导热性，低热膨胀系数的单片硅基底，并且其特征可以以低成本，可靠的方式形成为具有紧公差。 使用具有相似热膨胀系数的材料，以便在意外的加热和冷却期间保持对准。 此外，描述了基本上消除了将激光组件粘合到平台上的粘合剂的需要的方法。 所得到的激光器可以非常坚固，稳定，并且可以在延长的时间段内提供可靠的操作。

公开(公告)号：US06400740B1

公开(公告)日：2002-06-04

申请号：US09425837

申请日：1999-10-21

申请人： Arthur A. Karpinski

发明人： Arthur A. Karpinski

IPC分类号： H01S5024

CPC分类号： H01S3/0941 ,  H01S3/025 ,  H01S3/042 ,  H01S3/0606 ,  H01S5/02423 ,  H01S5/02469 ,  H01S5/4025

摘要： A support structure for the mounting of laser diode arrays, to facilitate the pumping of a suitably-shaped lasing medium, is constituted by a non-planar, preferably generally annularly-shaped, thermally conductive portion having an outer surface and an inner surface, the inner surface being shaped to accommodate an appropriate number of laser diode arrays to pump the medium. The outer surface may have cooling fins provided on the outside to facilitate the removal of heat from the vicinity of the laser diode arrays. Axial or circumferential cooling passages may be provided to facilitate removal of heat from the vicinity of the lasing medium, as well as the arrays. The lasing medium also may be surrounded by a cooling tube through which coolant flows, to facilitate removal of heat from the vicinity of the lasing medium in particular. A plurality of such support structures may be provided to accommodate higher power requirements, and also to enable greater distribution of laser light around and along the lasing medium, for more uniform pumping and/or power distribution. A method of fabricating the support structure, and a resulting diode laser pump apparatus also are disclosed.

摘要翻译： 用于安装激光二极管阵列以支持适当形状的激光介质的泵送的支撑结构由具有外表面和内表面的非平面，优选大体呈环形的导热部分构成， 内表面被成形为适应适当数量的激光二极管阵列来泵送介质。 外表面可以具有设置在外部的散热片，以便于从激光二极管阵列附近去除热量。 可以提供轴向或周向冷却通道以便于从激光介质附近以及阵列移除热量。 激光介质也可以被冷却剂流过的冷却管包围，以便于特别是从激光介质附近去除热量。 可以提供多个这样的支撑结构以适应更高的功率要求，并且还能够激发激光周围和沿着激光介质的更大分布，以实现更均匀的泵浦和/或功率分配。 公开了一种制造支撑结构的方法，以及所得到的二极管激光泵装置。

公开(公告)号：US06229831B1

公开(公告)日：2001-05-08

申请号：US09329846

申请日：1999-06-11

申请人： John L. Nightingale ,  Michael Hmelar

发明人： John L. Nightingale ,  Michael Hmelar

IPC分类号： H01S5024

CPC分类号： G02B6/4249 ,  H01S5/005 ,  H01S5/0224 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/02423 ,  H01S5/02484 ,  H01S5/4012 ,  H01S5/405

摘要： A light-source includes a plurality of diode-laser bars. The diode-laser bars are arranged in a parallel array and arranged to emit laser-light in the same direction. The diode-laser bars are mounted on a planar surface of a common heat-sink and are spaced-apart from each other in the emission-direction. Each diode-laser bar has one optical waveguide associated therewith. The optical-waveguides collect laser-light emitted from the diode-laser bars with which they are associated and deliver the collected laser-light to an output-aperture of the light-source. In one arrangement the diode-laser bars are mounted such that the emission-direction is parallel to the planar surface of the heat-sink, and the optical-waveguides are shaped to extend over diode-laser bars adjacent those with which they are associated. In another arrangement the diode-laser bars are mounted on the planar surface via wedge submounts such that the emission-direction is at an acute angle to the planar surface and the spacing of the diode-laser bars is selected such that the optical-waveguides can be straight yet still extend over adjacent diode-laser bars.

摘要翻译： 光源包括多个二极管激光条。 二极管激光棒被布置成并联阵列并且被布置成沿相同的方向发射激光。 二极管激光棒安装在公共散热器的平坦表面上，并且在发射方向上彼此间隔开。 每个二极管激光棒具有与其相关联的一个光波导。 光波导收集从它们相关联的二极管激光棒发射的激光，并将收集的激光传送到光源的输出孔。 在一种布置中，二极管激光条被安装成使得发射方向平行于散热器的平面表面，并且光波导被成形为在与它们相关联的二极管激光条上延伸。 在另一种布置中，二极管激光棒通过楔形基座安装在平坦表面上，使得发射方向与平坦表面成锐角，并且选择二极管激光条的间隔，使得光波导可以 直线但仍然延伸在相邻的二极管激光条上。

公开(公告)号：US06650668B2

公开(公告)日：2003-11-18

申请号：US09969338

申请日：2001-10-02

申请人： Alexander A. Yatskar ,  Serrena Marie Carter ,  R. Russel Austin

发明人： Alexander A. Yatskar ,  Serrena Marie Carter ,  R. Russel Austin

IPC分类号： H01S5024

CPC分类号： H01S3/0941 ,  H01S3/025 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/02407 ,  H01S5/02423 ,  H01S5/02469

摘要： A cylindrical two-dimensional diode-laser assembly includes fractionally-cylindrical dielectric segments bonded in a circular aperture in a metal heat-sink. Diode laser bars are located in gaps between the segments with light from the diode-lasers directed inwardly. The segments are made by cutting slots in one end of a tube of the dielectric material with the width of the slots corresponding to the width of the gaps and the part of the tube between slots providing the segments. The slotted tube is metallized and the slotted end of the tube is inserted into the heat-sink aperture with an unslotted part of the tube outside the aperture. The slotted part of the tube is bonded in the aperture and the unslotted part of the tube separated from the slotted part leaving the segments bonded in the aperture.

摘要翻译： 圆柱形二维二极管激光器组件包括结合在金属散热器中的圆形孔中的分数圆柱形介质段。 二极管激光条位于两段之间的间隙中，二极管激光器的光线向内指向。 这些段通过在电介质材料的管的一端中切割槽而制成，其中槽的宽度对应于间隙的宽度，并且管的部分在提供段之间的槽之间。 开槽管被金属化，并且管的开槽端插入散热孔中，管的未被切开的部分在孔的外部。 管的开槽部分接合在孔中，并且管的未开槽部分与开槽部分分离，留下接合在孔中的段。

公开(公告)号：US06295307B1

公开(公告)日：2001-09-25

申请号：US09170491

申请日：1998-10-13

申请人： Brian P. Hoden ,  Jon B. Jacob

发明人： Brian P. Hoden ,  Jon B. Jacob

IPC分类号： H01S5024

CPC分类号： H01S5/02264 ,  H01S5/02272 ,  H01S5/02476 ,  H01S5/4018 ,  H01S5/4043

摘要： A method and apparatus for laser diode bar assembly. A stacked array embodiment provides for efficient cooling of the diode bars and electrical connection between diode bars while maximizing alignment of the diode bars. The spacers are connected to a conductive surface on a heat spreader. In the stacked array, one or more diode bars are alternated in series with two or more conductive spacers, with a series circuit provided from diode bar to diode bar. The spacers hold the diodes spaced apart from insulating grooves in the conductive layer on the substrate. Alternatively, thermally conductive separator fins extend from the heat spreader substrate to contact the diode bars situated between the spacers to promote rapid heat transfer from the diodes while maintaining the diode bars electrically isolated from the conductive layer on the substrate. An apparatus and method are provided for assembling the stacked array assembly. A jig apparatus incorporates a tilted working surface upon which the diode bar/spacers subassembly is placed. Planar vertical walls extend up from the tilted working surface. The tilt to the working surface provides a gravity assist to the proper alignment of the diode bars and spacers against the vertical walls. A clamp squeezes the diode bars and spacers together and against one of the walls to foster optimized alignment and parallelism of the diode bars. A wedged array embodiment of the invention employs a specially grooved substrate. The diode bars are placed in the grooves, and customized wedges are then pressed into the grooves with the diodes therein, the wedges acting to push the diodes into proper parallel alignment in the grooves. Means for providing both series and parallel electrical circuits between diode bars are provided.

摘要翻译： 一种用于激光二极管棒组件的方法和装置。 堆叠阵列实施例提供二极管条的有效冷却和二极管条之间的电连接，同时使二极管条的对准最大化。 间隔件连接到散热器上的导电表面。 在堆叠阵列中，一个或多个二极管条与两个或更多个导电间隔物串联交替，其中串联电路从二极管条提供到二极管条。 间隔件将二极管与衬底上的导电层中的绝缘槽间隔开。 或者，导热隔板翅片从散热器基板延伸以接触位于间隔件之间的二极管条，以促进从二极管的快速热传递，同时保持二极管条与基板上的导电层电隔离。提供了一种设备和方法 用于组装堆叠阵列组件。 夹具装置包括倾斜的工作表面，二极管杆/间隔件子组件放置在该工作表面上。 平面垂直墙壁从倾斜的工作面向上延伸。 向工作表面的倾斜提供了重力辅助，以使二极管条和隔离物适当对准垂直壁。 夹具将二极管条和间隔件挤压在一起并抵靠其中一个壁以促进二极管条的优化对准和平行度。本发明的楔形阵列实施例采用特别开槽的基板。 将二极管条放置在凹槽中，然后将定制的楔形物压入其中具有二极管的凹槽中，楔形件用于将二极管推入槽中适当的平行对准。 提供了在二极管条之间提供串联和并联电路的装置。

公开(公告)号：US06266353B1

公开(公告)日：2001-07-24

申请号：US09365290

申请日：1999-07-30

申请人： Barry L. Freitas ,  Jay A. Skidmore ,  John P. Wooldridge ,  Mark A. Emanuel ,  Stephen A. Payne

发明人： Barry L. Freitas ,  Jay A. Skidmore ,  John P. Wooldridge ,  Mark A. Emanuel ,  Stephen A. Payne

IPC分类号： H01S5024

CPC分类号： H01S5/02264 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/4018

摘要： A monolithic, electrically-insulating substrate that contains a series of notched grooves is fabricated. The substrate is then metalized so that only the top surface and one wall adjacent to the notch are metalized. Within the grooves is located a laser bar, an electrically-conductive ribbon or contact bar and an elastomer which secures/registers the laser bar and ribbon (or contact bar) firmly along the wall of the groove that is adjacent to the notch. The invention includes several embodiments for providing electrical contact to the corresponding top surface of the adjacent wall. In one embodiment, after the bar is located in the proper position, the electrically conductive ribbon is bent so that it makes electrical contact with the adjoining metalized top side of the heatsink.

摘要翻译： 制造包含一系列凹槽的单片电绝缘基板。 然后将衬底金属化，使得只有顶部表面和与凹口相邻的一个壁被金属化。 在凹槽内设有激光棒，导电带或接触杆和弹性体，其牢固地固定/对准激光棒和带（或接触杆）沿着与凹口相邻的凹槽的壁。 本发明包括用于向相邻壁的对应顶表面提供电接触的若干实施例。 在一个实施例中，在杆位于适当位置之后，导电带被弯曲，使得其与散热器的相邻的金属化顶侧电接触。