Ultra low deposition rate PECVD silicon nitride
    2.
    发明授权
    Ultra low deposition rate PECVD silicon nitride 有权
    超低沉积速率PECVD氮化硅

    公开(公告)号:US06686232B1

    公开(公告)日:2004-02-03

    申请号:US10173717

    申请日:2002-06-19

    IPC分类号: H01L21471

    摘要: A thin silicon nitride layer is deposited at an ultra low deposition rate by PECVD by reducing the NH3 flow rate and/or reducing the SiH4 flow rate. Embodiments include depositing a thin layer of silicon nitride, e.g., 100 Å or less, on a thin silicon oxide liner over a gate electrode, at an NH3 flow rate of 100 to 800 sccm, a SiH4 flow rate of 50 to 100 sccm and a reduced pressure of 0.8 to 1.8 Torr. Embodiments of the present invention further include depositing the silicon nitride layer in multiple deposition stages, e.g., depositing the silicon nitride layer in five deposition stages of 20 Å each.

    摘要翻译: 通过减少NH 3流速和/或降低SiH 4流速,通过PECVD以超低沉积速率沉积薄的氮化硅层。 实施例包括在栅电极上的薄氧化硅衬垫上以100至800sccm的NH 3流速,50至100sccm的SiH 4流率和50至100sccm的SiH 4流速沉积例如100或更小的氮化硅薄层 0.8〜1.8乇减压。 本发明的实施例还包括在多个沉积阶段中沉积氮化硅层,例如,将氮化硅层沉积在各自的五个沉积阶段中。