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    Integrally formed thread lock retention feature
    1.
    发明授权
    Integrally formed thread lock retention feature 有权

    公开(公告)号：US11828318B2

    公开(公告)日：2023-11-28

    申请号：US18080018

    申请日：2022-12-13

    Applicant: WHIRLPOOL CORPORATION

    Inventor： Daniel A Schurr

    IPC: H01G2/04 ,  F16B37/08 ,  F16B29/00

    CPC classification number: F16B37/0842 ,  F16B29/00 ,  H01G2/04 ,  F16B2200/10

    Abstract: A laundry appliance includes a basement housing comprising a capacitor receiver. A capacitor is disposed within the capacitor receiver to define a secured position. The capacitor receiver includes at least one retaining flange that is coupled to the basement housing via a living hinge. At least one retaining flange is outwardly biased away from a body of the capacitor when the capacitor is placed in an inserted position. At least one retaining flange includes a thread-engaging surface that operates to the secured position upon rotation of the capacitor in the inserted position.

    SUPERCAPACITOR CARRIER AND SERVER
    3.
    发明申请
    SUPERCAPACITOR CARRIER AND SERVER 有权

    公开(公告)号：US20220270821A1

    公开(公告)日：2022-08-25

    申请号：US17348896

    申请日：2021-06-16

    Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

    Inventor： Shuai Zhang ,  Xiaogang Lu

    IPC: H01G2/04 ,  H01G11/78

    Abstract: This disclosure relates to a supercapacitor carrier configured to accommodate a supercapacitor and to be connected to a connector. The supercapacitor carrier includes a support component, a holder, and a baffle. The support component includes a substrate part and an insertion part. The substrate part is connected to the insertion part. The insertion part is configured to be inserted into the connector. The holder includes a main plate and a first side plate that are spaced apart from each other and form an accommodation space therebetween. The accommodation space is configured to accommodate the supercapacitor. The first side plate is connected to the main plate, and the first side plate is disposed on the substrate part. The baffle is disposed on the substrate part. The baffle and the insertion part are located at different sides of the substrate part.

    Structural Lead Frame
    5.
    发明申请
    Structural Lead Frame 有权

    公开(公告)号：US20210241977A1

    公开(公告)日：2021-08-05

    申请号：US17148038

    申请日：2021-01-13

    Applicant: KEMET Electronics Corporation

    Inventor： Galen W. Miller ,  John Bultitude ,  Lonnie G. Jones

    IPC: H01G4/38 ,  H01G4/30 ,  H01G2/08 ,  H01G2/04 ,  H05K1/18 ,  H01G2/10 ,  H01G13/00

    Abstract: Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.

    Capacitor with heat dissipater
    6.
    发明授权
    Capacitor with heat dissipater 有权

    公开(公告)号：US10978248B2

    公开(公告)日：2021-04-13

    申请号：US16052227

    申请日：2018-08-01

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： Yuki Koyama ,  Akihiro Ozaki

    IPC: H01G2/08 ,  H01G4/38 ,  H01G4/224 ,  H01G4/228 ,  H01G2/04 ,  H01G2/10 ,  H01G4/258

    Abstract: Film capacitor includes capacitor unit that has capacitor elements, upper bus bar, and lower bus bar. Capacitor elements have upper end electrodes and lower end electrodes that are connected to upper bus bar and lower bus bar, respectively. Film capacitor further includes case containing capacitor unit and being filled with filler resin, cooling plate near capacitor unit, and plate springs. Cooling plate is connected to a cooler and discharges heat generated from capacitor elements into the cooler. Plate springs apply an elastic force to capacitor unit in a direction toward cooling plate.

    Connection module
    8.
    发明授权
    Connection module 有权

    公开(公告)号：US10763628B2

    公开(公告)日：2020-09-01

    申请号：US16094112

    申请日：2017-04-13

    Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

    Inventor： Hiroki Shimoda ,  Shinichi Takase ,  Nobuyuki Matsumura ,  Yoshinori Ito

    IPC: H01M2/30 ,  H01R25/16 ,  H01G11/10 ,  H01G2/04 ,  H01M2/20 ,  H01M10/42 ,  H01R11/28

    Abstract: A connection module includes a plurality of bus bars that connect positive and negative electrode terminals of adjacent energy storage elements, a plurality of bus bar holding portions that hold bus bars in an insulated manner, and a pitch adjustment portion. The pitch adjustment portion is to be provided across the adjacent bus bar holding portions so as to couple the adjacent bus bar holding portions, and extends and contracts in a line-up direction of the plurality of bus bar holding portions so as to enable adjustment of a pitch between the positive and negative electrode terminals of the adjacent energy storage elements. Each of the bus bar holding portion includes a bus bar housing portion including an isolation wall that keeps the corresponding bus bars apart in an insulated manner. The bus bar housing portion includes, on one side in the line-up direction, a free portion where there is no isolation wall.

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