公开(公告)号：US06667194B1

公开(公告)日：2003-12-23

申请号：US10082278

申请日：2002-02-26

申请人： Lawrence N. Crane ,  Mark M. Konarski ,  J. Paul Krug ,  Andrew D. Messana ,  John G. Woods

发明人： Lawrence N. Crane ,  Mark M. Konarski ,  J. Paul Krug ,  Andrew D. Messana ,  John G. Woods

IPC分类号： C08L6302

CPC分类号： C07D303/22 ,  C07D303/24 ,  C07D303/44 ,  C08G59/12 ,  C08G59/42 ,  C08G59/5026 ,  C09J163/00 ,  H01L2224/27334 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29486 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01322 ,  H01L2924/0665 ,  Y10T428/12528 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2924/05032 ,  H01L2924/0503 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

摘要翻译： 包含在加热至140℃以上时释放苯酚或含羧酸化合物的材料的潜在助熔剂。潜溶剂可以并入包含环氧树脂的热固性树脂中。 包含环氧树脂，潜溶助熔剂和环氧固化剂的未固化环氧树脂在将具有一个或多个焊球的芯片裸片施加到基板的方法中可用作底部填充组合物。 该方法用于制造集成电路芯片，其包括具有以预定图案布置并且能够与载体基板电连接的电触头的芯片模具。

公开(公告)号：US06225417B1

公开(公告)日：2001-05-01

申请号：US09361303

申请日：1999-07-27

申请人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

发明人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC分类号： C08L6302

CPC分类号： C08L63/00 ,  C08G18/025 ,  C08G59/4021 ,  C08L79/02 ,  C08L2666/20

摘要： The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.

摘要翻译： 本发明提供一种单组分型环氧树脂组合物，其包含在分子中具有至少两个环氧基的环氧树脂和多胍。 单组分型环氧树脂组合物具有高储存稳定性，可制成薄膜，可在相对较低的温度下固化，并且具有高粘合性。

公开(公告)号：US06569922B2

公开(公告)日：2003-05-27

申请号：US09790674

申请日：2001-02-23

申请人： Maki Sugino ,  Hiroki Hirata ,  Katsumi Ogi

发明人： Maki Sugino ,  Hiroki Hirata ,  Katsumi Ogi

IPC分类号： C08L6302

CPC分类号： B82Y30/00 ,  C01P2004/64 ,  C01P2004/84 ,  C01P2006/12 ,  C01P2006/22 ,  C01P2006/80 ,  C09C1/3063 ,  Y10T428/2991 ,  Y10T428/2993

摘要： A silica powder surface-treated with and epoxy compound having a plurality of epoxy groups, in which at least one epoxy group of the epoxy compound is ring-opened to bind to the surface of the silica powder and at least a portion of the remaining epoxy groups of the epoxy compound are bonded to amine compounds. The silica powder may be produced by the surface treatment of a silica powder with an epoxy compound and an amine compound successively or with both these compound simultaneously.

摘要翻译： 表面处理的二氧化硅粉末和具有多个环氧基的环氧化合物，其中环氧化合物的至少一个环氧基开环以结合二氧化硅粉末的表面和至少一部分剩余的环氧树脂 环氧化合物的基团与胺化合物键合。 二氧化硅粉末可以通过二氧化硅粉末与环氧化合物和胺化合物相继地或与这两种化合物同时表面处理来制备。

公开(公告)号：US06476160B1

公开(公告)日：2002-11-05

申请号：US09356057

申请日：1999-07-16

申请人： Hiroyuki Okuhira ,  Naoya Adachi

发明人： Hiroyuki Okuhira ,  Naoya Adachi

IPC分类号： C08L6302

CPC分类号： C08G18/765 ,  C08G18/58 ,  C08G59/14 ,  C08G59/4042

摘要： A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.

摘要翻译： 包含环氧树脂和酮亚胺化合物的组合物，其中所述环氧树脂是（1）分子中具有不超过羟基的环氧树脂的含量在大于90摩尔％至100摩尔％的范围内的环氧树脂， 或更少，（2）环氧树脂，其中羟基被含异氰酸酯基的化合物封端，（3）环氧树脂，其中羟基被含烷氧基甲硅烷基的化合物封端，或（4）含有 能够封端环氧树脂的羟基的含烷氧基甲硅烷基的化合物。 当使用这些环氧树脂中的任一种并且也使用具有高空间位阻的酮亚胺化合物时，可以提供具有良好的固化性和特别优异的储存稳定性的单组分环氧树脂组合物。

公开(公告)号：US06372826B1

公开(公告)日：2002-04-16

申请号：US08568114

申请日：1995-12-06

申请人： Glen R. Greenberg ,  Robert M. Richardello ,  Richard L. Frentzel

发明人： Glen R. Greenberg ,  Robert M. Richardello ,  Richard L. Frentzel

IPC分类号： C08L6302

CPC分类号： C08L63/00 ,  C08L2666/04

摘要： A curable composition useful for repairing worn surfaces on housings comprising an admixture of: (1) a mixture of (a) an one-component epoxy resin, (b) solvent and (c) reactive diluent, wherein said epoxy resin is present in a major amount in said mixture; (2) graphite powder; and (3) polytetrafluoroethylene powder.

摘要翻译： 一种可用于修复外壳上磨损表面的可固化组合物，其包含以下混合物的混合物：（1）单组分环氧树脂，（b）溶剂和（c）反应性稀释剂的混合物，其中所述环氧树脂存在于 所述混合物中主要量;（2）石墨粉; 和（3）聚四氟乙烯粉末。

公开(公告)号：US06239232B1

公开(公告)日：2001-05-29

申请号：US09235336

申请日：1999-01-22

申请人： Yves Camberlin ,  Jacky Grenier ,  Jacques Vallet ,  Anthony Bonnet ,  Jean-Pierre Pascault ,  Mohamed Taha

发明人： Yves Camberlin ,  Jacky Grenier ,  Jacques Vallet ,  Anthony Bonnet ,  Jean-Pierre Pascault ,  Mohamed Taha

IPC分类号： C08L6302

CPC分类号： C08L63/00 ,  C08G59/5033 ,  Y10T428/24994 ,  C08L81/00 ,  C08L79/08

摘要： A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones and at least one epoxy resin modified by at least one aromatic polyamine. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups. The thermoplastic polymer content is preferably about 15% to 98% by weight with respect to the total weight of the polymer composition; the amount of epoxy resin modified by at least one aromatic polyamine is about 2% to 85% by weight with respect to the total weight of the polymer composition. These polymer compositions can be prepared in the molten state, without a solvent, at a temperature of about 100° C. to 250° C.

摘要翻译： 聚合物组合物包含至少一种选自由聚醚酰亚胺和聚砜形成的基团的热塑性聚合物和至少一种由至少一种芳族多胺改性的环氧树脂。 环氧树脂由其分子中至少含有至少2个环氧基的聚环氧化物形成，芳族多胺在其分子中含有至少两个伯胺基团，优选至少一个含1至12个碳原子的烷基取代基位于一个 的氨基。 多胺与环氧的摩尔比使得每个氨基相当于1.6-2.6个环氧基。 相对于聚合物组合物的总重量，热塑性聚合物含量优选为约15％至98％重量; 由至少一种芳族多胺改性的环氧树脂的量相对于聚合物组合物的总重量为约2重量％至85重量％。 这些聚合物组合物可以在没有溶剂的情况下在约100℃至250℃的温度下以熔融状态制备。

公开(公告)号：US06743837B2

公开(公告)日：2004-06-01

申请号：US09929457

申请日：2001-08-14

申请人： Hoon Chung ,  Seung-Jae Baek ,  Jong-Myung Hong ,  Ki-Myong Song

发明人： Hoon Chung ,  Seung-Jae Baek ,  Jong-Myung Hong ,  Ki-Myong Song

IPC分类号： C08L6302

CPC分类号： C09D5/4492 ,  C09D5/4473

摘要： Disclosed are a resin dispersion and a cationic electrodeposition coating composition including the same, in which the dried coating film of the electrodeposition paint is lead-free and has an epoxy-acrylic double-layered structure for displaying excellent properties, and in which an organic solvent content can be minimized. A resin dispersion of a cationic electrodeposition includes an aqueous dispersion prepared by the following processes. The resin dispersion includes a cationic electrodeposition resin, deionized water, an acid for neutralization, a reaction product of manganese phosphate and an acid diluted in an deionized water to 10%, and a cationic surfactant. The cationic electrodeposition resin can be prepared in the presence of an organic solvent from (a) a cationic electrodeposition synthetic resin produced by an epoxy-amino addition reaction (b) an acrylic cationic electrodeposition resin having an amino group (c) a fatty acid ester resin synthesized by an esterfication reaction of styrene-allylalcohol copolymer and fatty acid and (d) blocked polyisocyanatecuring agent. The cured film has an epoxy-acrylic double-layered structure to give a high functionality, for improving properties such as weather-resistance, yellowing resistance, etc.

摘要翻译： 公开了一种树脂分散体和阳离子电沉积涂料组合物，其中电沉积涂料的干燥涂膜是无铅的并具有优异性能的环氧丙烯酸双层结构，其中有机溶剂 内容可以最小化。 阳离子电沉积的树脂分散体包括通过以下方法制备的水分散体。 树脂分散体包括阳离子电沉积树脂，去离子水，中和酸，磷酸锰的反应产物和在去离子水中稀释至10％的酸和阳离子表面活性剂。 阳离子电沉积树脂可以在有机溶剂的存在下由（a）通过环氧 - 氨基加成反应制备的阳离子电沉积合成树脂（b）具有氨基（c）脂肪酸酯的丙烯酸阳离子电沉积树脂 通过苯乙烯 - 烯丙醇共聚物和脂肪酸的酯化反应合成的树脂和（d）封端的聚异氰酸酯固化剂。 固化膜具有环氧 - 丙烯酸双层结构，以提供高功能性，用于改善耐候性，耐黄变性等性能。

公开(公告)号：US06624213B2

公开(公告)日：2003-09-23

申请号：US10005556

申请日：2001-11-08

申请人： Clayton A. George ,  William J. Schultz ,  Wendy L. Thompson

发明人： Clayton A. George ,  William J. Schultz ,  Wendy L. Thompson

IPC分类号： C08L6302

CPC分类号： C09J163/00 ,  C08G59/50 ,  C08K5/18 ,  C08L63/00

摘要： The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

摘要翻译： 本发明提供了含环脂族聚环氧树脂，芳族聚环氧化物树脂和9,9-双（3-甲基-4-氨基苯基）芴的聚环氧化物基粘合剂。 粘合剂提供改善的剥离和剪切强度。

公开(公告)号：US06608148B1

公开(公告)日：2003-08-19

申请号：US09868618

申请日：2001-06-22

申请人： Takeo Kuroda ,  Tsuyoshi Hasegawa ,  Masanori Matsuda ,  Takeshi Miyake ,  Takashi Shinjo

发明人： Takeo Kuroda ,  Tsuyoshi Hasegawa ,  Masanori Matsuda ,  Takeshi Miyake ,  Takashi Shinjo

IPC分类号： C08L6302

CPC分类号： C09J171/02 ,  C08L2666/34 ,  C09J163/00

摘要： The invention is a reactive hot melt adhesive composition comprising a cationically polymerizable compound, on the average per molecule, having one or more cyclic ether groups such as epoxy groups, a phthalate diester compound expressed by the following formula (2) and a cationic photo-initiator: wherein in the formula (2), R5 indicates (ChH2hO)iH and R6 indicates (CkH2kO)lH or (CkH2kO)lCkH2k+1, provided that h, i, k and l each are an integer of 1 or more. The present invention provides a reactive hot melt adhesive, in which a curing reaction progresses under application of actinic radiation.

摘要翻译： 本发明是一种反应性热熔粘合剂组合物，其包含平均每分子具有一个或多个环醚基团的阳离子聚合性化合物，例如环氧基，由下式（2）表示的邻苯二甲酸二酯化合物和阳离子光引发剂， 起始物：其中，在式（2）中，R5表示（ChH2hO）iH，R6表示（CkH2kO）1H或（CkH2kO）lCkH2k + 1，条件是h，i，k和l各自为1或更大的整数。 本发明提供一种反应性热熔粘合剂，其中固化反应在光化辐射的应用下进行。

公开(公告)号：US06531549B2

公开(公告)日：2003-03-11

申请号：US10012323

申请日：2001-12-12

申请人： Yasuyuki Murata ,  Masayuki Tsutsumi ,  Kiyotaka Ikebata ,  Ken Tanaka

发明人： Yasuyuki Murata ,  Masayuki Tsutsumi ,  Kiyotaka Ikebata ,  Ken Tanaka

IPC分类号： C08L6302

CPC分类号： C08G59/063 ,  C08G59/245

摘要： A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130° C. to an endotherm between 80° C. and 125° C., measured by raising the temperature at a rate of 10° C. per minute using a DSC device, is 1.03 or more.