公开(公告)号：US20040188500A1

公开(公告)日：2004-09-30

申请号：US10708890

申请日：2004-03-30

Applicant: LITTON SYSTEMS, INC.

Inventor： Niels F. Jacksen ,  Michael J. Iosue ,  Miguel M. Saldana ,  Jay Scott Tucker

IPC: B23K020/00

CPC classification number: B23K20/16 ,  B23K20/023 ,  C04B37/04 ,  C04B2237/124 ,  C04B2237/125 ,  H01J31/507 ,  H01J43/246 ,  H01J2231/5016

Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).

Abstract translation: 微通道板（MCP）（50）和多层陶瓷体（80）单元的配合面使用在期望的温度和压力下选择用于最佳扩散的合适金属沉积具有突起（84）的薄膜。 金属化MCP（50）和多层陶瓷体（80）单元然后对准并放置在粘合夹具（F）中，其提供施加到部件上的必要的力以在期望的高温下引发扩散接合。 接合夹具（F）然后被放置在真空加热室（V）中，以加速MCP（50）和多层陶瓷体单元（80）之间的扩散接合过程。

公开(公告)号：US20040173665A1

公开(公告)日：2004-09-09

申请号：US10384429

申请日：2003-03-07

Inventor： Hamid R. Eslampour

IPC: B23K020/00

CPC classification number: H01L24/81 ,  B23K20/023 ,  B23K2101/40 ,  H01L25/167 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2924/01006 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an electric terminal of the second device. The electric contact is tacked to the electric terminal by simultaneously applying heat and pressure between the electric contact and the electric terminal. The electric contact is subsequently diffusion-bonded to the electric terminal by applying heat to the electric contact and the electric terminal for a select period of time while a pressure between the electric contact and the electric terminal is reduced relative to the pressure when tacking the electric contact to the electric terminal.

Abstract translation: 提供了一种用于将第一电子设备电气地和机械地连接到第二电子设备的方法。 第一装置的至少一个电接触件抵靠第二装置的电端子定位。 电触点同时在电触头和电端子之间施加热和压力，将电触点固定在电气端子上。 随后，电接触件通过在电接点和电端子上施加热量一段时间而扩散接合到电端子上，同时电触点和电端子之间的压力相对于电压 接触电气终端。

公开(公告)号：US20040129560A1

公开(公告)日：2004-07-08

申请号：US10674281

申请日：2003-09-29

Inventor： Charles E. Wickersham JR.

IPC: C23C014/32 ,  B23K020/08 ,  B23K020/00 ,  B23K028/00

CPC classification number: H01J37/3435 ,  C23C14/3407 ,  C23C14/3414

Abstract: A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.

Abstract translation: 描述了一种形成溅射靶的方法，该方法包括将背板粘合到具有一个或多个含有目标材料的凹部以形成粘合靶的小屋顶上。 在接合过程中，粘合靶可选地在凹部内被真空密封。 然后在真空下任意地退火接合的靶，以形成退火的溅射靶。 然后可以通过以一个或几个步骤从溅射靶去除至少一部分窗口来获取溅射靶。 还描述了一种具有一个或多个包含可选择地真空密封在平整物中的结合目标材料的凹部的窗体。 进一步描述了平整度以及可选地粘合到窗扇上的背板以及其它选项和方法。

公开(公告)号：US20040169063A1

公开(公告)日：2004-09-02

申请号：US10200770

申请日：2002-07-22

Applicant: Triumph Brands, Inc.

Inventor： Richard J. Stueber ,  Brenton L. Blanche

IPC: B23K020/00

CPC classification number: B23K35/004 ,  B23K20/002 ,  B23K20/021 ,  B23K20/16 ,  B23K20/227 ,  B23K20/24 ,  B23K35/3615 ,  B23K35/3616 ,  B23K35/3617 ,  B23K2101/001 ,  B23K2103/05

Abstract: A method of joining superalloy substrates together comprises diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter subjecting the joint to heat and pressure. The heat and pressure causes the surface of the superalloy, in the presence of the activator, to diffusion bond without the use of a brazing alloy. By eliminating the brazing alloy, a high strength, high temperature bond is achieved, yet there is no molten brazing alloy to be drawn through capillary action into any fine features surrounding the joint being bonded, and there is no residue left at the interface that would diminish the mechanical or chemical properties of the joint.

Abstract translation: 将超合金基板接合在一起的方法包括通过在要接合的接头的表面上直接沉积激活剂然后使接头进行加热和加压来扩散接合超合金基板。 在不使用钎焊合金的情况下，热和压力导致超级合金的表面在活化剂存在下扩散接合。 通过消除钎焊合金，实现了高强度，高温粘结，但是没有熔融钎焊合金通过毛细作用被拉伸到围绕接合接头的任何细小特征中，并且在界面处没有残留物 降低接头的机械或化学性能。

公开(公告)号：US20020179688A1

公开(公告)日：2002-12-05

申请号：US10199759

申请日：2002-07-17

Applicant: The Boeing Company

Inventor： Daniel G. Sanders

IPC: B23K020/00

CPC classification number: B21D26/055 ,  B23K20/02

Abstract: A multisheet structure is made using compression diffusion bonding according to the present invention using a CRES template to apply increased pressure in the areas designated for diffusion bonds (DB) to improve the bond quality and to reduce the processing time. The CRES template is patterned to correspond with the DB arrangement in the superplastically formed part. The forming press forces the template against the pack of SPF sheets to provide 300-1200 psi or more pressure along the bond lines to speed their formation.

Abstract translation: 使用CRES模板使用根据本发明的压缩扩散接合来制造多片层结构，以在指定用于扩散接合（DB）的区域中施加增加的压力，以提高粘合质量并缩短加工时间。 图案化CRES模板以与超塑性部件中的DB布置相对应。 成型压力机迫使模板抵抗SPF片材组，以沿着粘合线提供300-1200psi或更大的压力以加速它们的形成。

公开(公告)号：US20020074381A1

公开(公告)日：2002-06-20

申请号：US10017350

申请日：2001-12-14

Applicant: Unitive International Limited

Inventor： Glenn A. Rinne ,  Krishna K. Nair

IPC: B23K020/00 ,  B23K028/00

CPC classification number: G02B6/3628 ,  B23K1/0004 ,  G02B6/3636 ,  G02B6/3692

Abstract: Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.

Abstract translation: 粘合两个部件的方法可以包括相对于彼此定位组件以获得期望的取向。 一旦获得了所需的取向，就可以将金属成分按期望的方向与金属结合，其中两种成分的温度在粘合时保持在金属的熔融温度以下。 还讨论了相关结构。

公开(公告)号：US20030150901A1

公开(公告)日：2003-08-14

申请号：US10071129

申请日：2002-02-08

Inventor： Theodore Robert Grossman ,  Ronald Gustav Rajala ,  Dwayne Edward Burnett ,  William Scott Walston ,  Wendy Howard Murphy

IPC: B23K020/00

CPC classification number: F01D5/288 ,  C23C10/02 ,  C23C10/52 ,  C23C10/60 ,  Y02T50/67 ,  Y10T428/1275

Abstract: A coated nickel-base superalloy article, which is otherwise susceptible to the formation of a secondary reaction zone, is prepared by furnishing a nickel-base superalloy article substrate having thereon an initial aluminum-containing coating comprising an initial-coating additive zone and an initial-coating diffusion zone. The article is susceptible to the formation of the secondary reaction zone if heated to an elevated SRZ reaction temperature for an SRZ reaction period of time. The formation of the secondary reaction zone is avoided by first removing the initial-coating additive zone and the initial-coating diffusion zone, and thereafter depositing a subsequent aluminum-containing coating onto the article substrate. The subsequent aluminum-containing coating includes a subsequent-coating additive zone and a subsequent-coating diffusion zone. The article substrate with the subsequent aluminum-containing coating is otherwise susceptible to the formation of the secondary reaction zone if heated to the elevated SRZ reaction temperature for the SRZ reaction period of time.

Abstract translation: 通过提供其上具有初始含铝涂层的镍基超级合金制品基底来制备另外易于形成次级反应区的涂覆的镍基超级合金制品，所述初始含铝涂层包含初始涂层添加区和初始涂层添加区 涂层扩散区。 如果在SRZ反应时间段内加热到升高的SRZ反应温度，则该制品易于形成次级反应区。 通过首先去除初始涂层添加剂区域和初始涂覆扩散区，然后将随后的含铝涂层沉积到制品基材上，避免二次反应区的形成。 随后的含铝涂层包括随后的涂层添加剂区域和随后的涂覆扩散区域。 如果加热到SRZ反应时间段的升高的SRZ反应温度，则具有随后的含铝涂层的制品基材否则易于形成次级反应区。

公开(公告)号：US20030038165A1

公开(公告)日：2003-02-27

申请号：US10239322

申请日：2002-09-18

Inventor： Veikko Polvi

IPC: B23K020/00

CPC classification number: B23K1/0016 ,  B23K35/007 ,  B23K35/0238 ,  B23K35/3006 ,  B23K2101/26 ,  B23K2103/12 ,  H01R43/02 ,  H05K3/341 ,  H05K3/3478 ,  Y10T428/12528

Abstract: A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil (3) comprising surface layers (4, 6) and an intermediate layer (5) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.

Abstract translation: 一种用铜或铜合金制导电导体导体的导电接头的制造方法，其中在要接合的导体轨道元件之间的方法中，应用焊接/钎焊剂，此后至少加热接合区域，因此 创建了一个联合。 根据该方法，使用的焊接/钎焊剂是其间包括表面层（4,6）和中间层（5）的层状焊接/钎焊剂箔（3），并且接合区域被热处理，使得 扩散接头被创建。

公开(公告)号：US20020121437A1

公开(公告)日：2002-09-05

申请号：US10083123

申请日：2002-02-27

Applicant: Vacuum Metallurgical Co., Ltd.

Inventor： Yasuo Nakadai ,  Poong Kim ,  Weiping Chai ,  Masahiro Kodera

IPC: C23C014/00 ,  B23K028/00 ,  B23K020/00 ,  C25B009/00 ,  C25B011/00 ,  C25B013/00

CPC classification number: B23K35/007 ,  B23K35/005 ,  B23K35/3006 ,  B23K2103/14 ,  C23C14/3414

Abstract: A titanium target assembly comprises a sputtering target of titanium, a backing plate composed of copper or a copper alloy and serving as a support member for the target and a coating film composed of silver or a silver alloy and formed between the target and the backing plate, wherein the coating film is formed on the surface subjected to a cleaning treatment on the bonding side of the target or on the bonding sides of the target and the backing plate according to the physical vapor deposition technique and the titanium target and the backing plate are solid phase diffusion bonded, while the face(s) provided with the coating film serves as the bonding plane. The titanium target assembly can be manufactured by a method comprising the steps of cleaning the surface(s) of the target and/or the backing plate on the bonding side(s) thereof, forming a coating film on the cleaned surface(s) on the bonding side(s) and solid phase diffusion-bonding the target and the backing plate at a pressure of not more than 0.1 Pa, a temperature of not less than 400null C. and not more than 450null C. and an applied load during bonding of not less than 40 MPa and not more than 100 MPa for a time of not more than 2 hours, while using the surface(s) provided with the coated film as the bonding plane. The titanium target assembly possesses a high bonding strength and excellent bonding stability and reliability.

Abstract translation: 钛靶组件包括钛的溅射靶，由铜或铜合金构成的背板，用作靶的支撑构件和由银或银合金构成的涂膜，并形成在靶和背板之间 其特征在于，根据所述物理气相沉积技术，在所述靶的接合侧或所述靶和所述背板的接合侧上进行清洗处理的表面上形成所述涂膜，所述钛靶和所述背板为 固相扩散接合，而设置有涂膜的面用作接合面。 钛靶组件可以通过一种方法制造，该方法包括以下步骤：在其粘合侧清洁靶和/或背板的表面，在清洁的表面上形成涂膜， 粘合侧和固相在不超过0.1Pa的压力，不低于400℃且不高于450℃的温度下施加载荷和固定相，并且施加的载荷 在使用设置有涂膜的表面作为接合面的情况下，在不低于40MPa且不大于100MPa的接合期间不超过2小时。 钛靶组件具有高的结合强度和优异的粘合稳定性和可靠性。

公开(公告)号：US20040050912A1

公开(公告)日：2004-03-18

申请号：US10242451

申请日：2002-09-13

Inventor： William R. Spencer

IPC: B23K020/00

CPC classification number: B23K35/005 ,  B23K20/023 ,  B23K20/16 ,  B23K20/22 ,  B23K20/233 ,  B23K35/3033 ,  B23K35/3046 ,  B23K35/3053 ,  B23K35/322 ,  Y10T428/1284

Abstract: A method for producing diffusion bonds between components formed of tungsten heavy alloy (WHA) uses aid material to accelerate diffusion across the joint surfaces. The aid material consists of an alloy of palladium (Pd) with one or more of the secondary elements of nickel (Ni), iron (Fe), or cobalt (Co). The secondary elements are selected to correspond to the secondary elements present in the components. The diffusion bonding is carried out by placing diffusion aid material between the joint surfaces of adjacent components, applying a pressure across the joint surfaces, and processing the assembly through a thermal profile. Structures of WHA with complex shapes, interior volumes and/or large sizes can be formed. The joint properties are equal to or superior to those of the parent material of the components.

Abstract translation: 由钨重合金（WHA）形成的部件之间产生扩散接合的方法使用辅助材料来加速跨接头表面的扩散。 辅助材料由钯（Pd）与镍（Ni），铁（Fe）或钴（Co）的一种或多种次要元素的合金组成。 选择次要元件以对应于存在于部件中的次要元件。 扩散接合通过将扩散辅助材料放置在相邻部件的接合表面之间，在接合表面上施加压力，并通过热分布来处理该组件来进行。 可以形成具有复杂形状，内部体积和/或大尺寸的WHA的结构。 接合性能等于或优于组分母体材料的接合性能。