Titanium target assembly for sputtering and method for preparing the same
    1.
    发明申请
    Titanium target assembly for sputtering and method for preparing the same 有权
    用于溅射的钛靶组件及其制备方法

    公开(公告)号:US20020121437A1

    公开(公告)日:2002-09-05

    申请号:US10083123

    申请日:2002-02-27

    Abstract: A titanium target assembly comprises a sputtering target of titanium, a backing plate composed of copper or a copper alloy and serving as a support member for the target and a coating film composed of silver or a silver alloy and formed between the target and the backing plate, wherein the coating film is formed on the surface subjected to a cleaning treatment on the bonding side of the target or on the bonding sides of the target and the backing plate according to the physical vapor deposition technique and the titanium target and the backing plate are solid phase diffusion bonded, while the face(s) provided with the coating film serves as the bonding plane. The titanium target assembly can be manufactured by a method comprising the steps of cleaning the surface(s) of the target and/or the backing plate on the bonding side(s) thereof, forming a coating film on the cleaned surface(s) on the bonding side(s) and solid phase diffusion-bonding the target and the backing plate at a pressure of not more than 0.1 Pa, a temperature of not less than 400null C. and not more than 450null C. and an applied load during bonding of not less than 40 MPa and not more than 100 MPa for a time of not more than 2 hours, while using the surface(s) provided with the coated film as the bonding plane. The titanium target assembly possesses a high bonding strength and excellent bonding stability and reliability.

    Abstract translation: 钛靶组件包括钛的溅射靶,由铜或铜合金构成的背板,用作靶的支撑构件和由银或银合金构成的涂膜,并形成在靶和背板之间 其特征在于,根据所述物理气相沉积技术,在所述靶的接合侧或所述靶和所述背板的接合侧上进行清洗处理的表面上形成所述涂膜,所述钛靶和所述背板为 固相扩散接合,而设置有涂膜的面用作接合面。 钛靶组件可以通过一种方法制造,该方法包括以下步骤:在其粘合侧清洁靶和/或背板的表面,在清洁的表面上形成涂膜, 粘合侧和固相在不超过0.1Pa的压力,不低于400℃且不高于450℃的温度下施加载荷和固定相,并且施加的载荷 在使用设置有涂膜的表面作为接合面的情况下,在不低于40MPa且不大于100MPa的接合期间不超过2小时。 钛靶组件具有高的结合强度和优异的粘合稳定性和可靠性。

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