公开(公告)号：US20180277510A1

公开(公告)日：2018-09-27

申请号：US15813676

申请日：2017-11-15

Applicant: International Business Machines Corporation

Inventor： ERIC J. CAMPBELL ,  SARAH K. CZAPLEWSKI ,  ELIN LABRECK ,  JENNIFER I. PORTO

IPC: H01L23/00 ,  C09K5/10 ,  H01L23/373 ,  H01L23/367

CPC classification number: H01L24/83 ,  C09K5/10 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3737 ,  H01L23/42 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/271 ,  H01L2224/2731 ,  H01L2224/2755 ,  H01L2224/2783 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83201 ,  H01L2224/83874 ,  H01L2224/83986 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/0715 ,  H01L2924/1434 ,  H01L2924/20211 ,  H01L2924/20212 ,  H01L2924/20213 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/0625

Abstract: A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.