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    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    6.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    复合电子元件及其相应的板

    公开(公告)号：US20160027594A1

    公开(公告)日：2016-01-28

    申请号：US14811463

    申请日：2015-07-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Sang Soo PARK ,  Byoung Hwa LEE ,  Kyo Kwang LEE

    IPC: H01G15/00 ,  H01G4/012 ,  H01G4/12 ,  H01G9/042 ,  H01G4/224 ,  H05K1/18 ,  H01G9/012 ,  H01G9/025 ,  H01G4/30 ,  H01G4/228

    CPC classification number: H01G15/00 ,  H01G2/06 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H01G9/012 ,  H01G9/08 ,  H01G9/28 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

    Abstract: A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.

    Abstract translation: 复合电子部件包括绝缘片，钽电容器，其包括包含烧结钽粉末的主体部分和钽线，其一部分嵌入在主体部分中，并且设置在绝缘片上，多层陶瓷电容器包括： 包括多个电介质层的陶瓷体，第一和第二内部电极以及第一和第二外部电极，并且设置在绝缘片上，以及封装钽电容器和多层陶瓷电容器的模制部分。 第一内部电极包括从长度方向引出到上表面和下表面的第一引线部分和陶瓷体的第一端面，并且第二内部电极包括引导到上表面和下表面的第二引线部分和 陶瓷体的长度方向的第二端面。

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    7.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    复合电子元件及其相应的板

    公开(公告)号：US20160020031A1

    公开(公告)日：2016-01-21

    申请号：US14635622

    申请日：2015-03-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hong Kyu SHIN ,  Jae Hyuk CHOI ,  Hyun Sub OH

    IPC: H01G4/38 ,  H01G4/12 ,  H01G2/06 ,  H01G4/248 ,  H01G4/012 ,  H01G4/30 ,  H01G9/052

    CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/35 ,  H01G9/012 ,  H01G9/052 ,  H01G9/28 ,  H01G15/00 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/613

    Abstract: A composite electronic component includes: an insulating sheet; a tantalum capacitor including a body part containing a material formed of sintered tantalum powder particles and a tantalum wire partially embedded in the body part and disposed on the insulating sheet; a multilayer ceramic capacitor (MLCC) including a ceramic body in which dielectric layers and internal electrodes are alternatingly disposed and first and second external electrodes disposed on a lower surface of the ceramic body and disposed on the insulating sheet; and a molding part disposed to enclose the tantalum capacitor and the multilayer ceramic capacitor, wherein at least one of the tantalum capacitor and the multilayer ceramic capacitor includes a plurality of capacitors.

    Abstract translation: 复合电子部件包括：绝缘片; 一种钽电容器，包括：主体部分，其包含由烧结的钽粉末颗粒形成的材料;以及钽丝，其部分地嵌入在所述主体部分中并设置在所述绝缘片上; 包括陶瓷体的多层陶瓷电容器（MLCC），其中电介质层和内部电极交替布置，并且第一和第二外部电极设置在陶瓷体的下表面上并且设置在绝缘片上; 以及设置成包围钽电容器和多层陶瓷电容器的成型部，其中，钽电容器和多层陶瓷电容器中的至少一个包括多个电容器。

    CAPACITOR ARRAY AND LAYOUT DESIGN METHOD THEREOF
    8.
    发明申请
    CAPACITOR ARRAY AND LAYOUT DESIGN METHOD THEREOF 有权
    电容阵列和布局设计方法

    公开(公告)号：US20150370952A1

    公开(公告)日：2015-12-24

    申请号：US14396737

    申请日：2013-11-28

    Applicant: CHINA ELECTRONIC TECHNOLOGY CORPORATION, 24TH RESEARCH INSTITUTE

    Inventor： YAN WANG ,  YU-XIN WANG ,  GANG-YI HU ,  TING LI ,  TAO LIU ,  GUANG-BING CHEN

    IPC: G06F17/50 ,  H01G4/38

    CPC classification number: G06F17/5072 ,  G06F17/50 ,  G06F17/5077 ,  H01G4/38 ,  H01G15/00 ,  H03M1/164 ,  H03M1/442

    Abstract: A layout design method is provided for generating capacitor arrays being described in four steps: first, the wiring mode of unit capacitors is defined allowing the wire being connected to the upper plate to parallel that to the lower one, second, a capacitor array layout is designed with capacitors being distributed in Mh lines, Mh is the maximum of capacitors' lines, the line numbers of Class 1 to Class K capacitors are defined in the unilateral capacitor array, third, the wiring mode is set for capacitor array making sure the lengths of the wires to the upper and lower plates of unit capacitors are equal, at last, parasitic parameters are characterized in ways that verify the layout. A capacitor array is provided as well. By eliminating capacitance mismatching caused by parasitic capacitance, the method works to generate a well-matched capacitor array in an easy and efficient way.

    Abstract translation: 提供一种用于产生电容器阵列的布局设计方法，其分为四个步骤：首先，确定单元电容器的布线模式，允许将导线连接到上板与下板平行;第二，电容器阵列布局为 设计有电容分布在Mh线，Mh是电容器线的最大值，单相电容器阵列中定义了1类至K类电容器的线数;第三，为电容器阵列设置了布线模式，确保长度 到单元电容器的上板和下板的电线相等，最后，寄生参数以验证布局的方式进行表征。 还提供电容器阵列。 通过消除由寄生电容引起的电容失配，该方法可以以简单有效的方式产生良好匹配的电容器阵列。

    VARIABLE CAPACITANCE CIRCUIT AND IMPEDANCE MATCHING CIRCUIT
    9.
    发明申请
    VARIABLE CAPACITANCE CIRCUIT AND IMPEDANCE MATCHING CIRCUIT 有权
    可变电容电路和阻抗匹配电路

    公开(公告)号：US20150162889A1

    公开(公告)日：2015-06-11

    申请号：US14621528

    申请日：2015-02-13

    Applicant: FUJITSU LIMITED

    Inventor： Takeaki SHIMANOUCHI

    IPC: H03H7/38 ,  H01G15/00

    CPC classification number: H03H7/38 ,  H01G5/16 ,  H01G5/38 ,  H01G15/00

    Abstract: A first variable capacitance section included in a variable capacitance circuit includes a plurality of first variable capacitance elements connected to a signal line and each having a first capacitance value or a second capacitance value greater than the first capacitance value according to driving voltage, and includes a first fixed capacitance element connected in series with the plurality of first variable capacitance elements. A second variable capacitance section included in the variable capacitance circuit includes a second variable capacitance element connected to the signal line and having the first capacitance value or the second capacitance value according to the driving voltage, and includes a second fixed capacitance element connected in series with the second variable capacitance element.

    Abstract translation: 包括在可变电容电路中的第一可变电容部分包括多个连接到信号线的第一可变电容元件，并且每个具有根据驱动电压的第一电容值或大于第一电容值的第二电容值，并且包括 第一固定电容元件与多个第一可变电容元件串联连接。 包括在可变电容电路中的第二可变电容部分包括连接到信号线并根据驱动电压具有第一电容值或第二电容值的第二可变电容元件，并且包括与第一可变电容元件串联连接的第二固定电容元件 第二可变电容元件。

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