摘要:
A first time/temperature data set includes temperatures and time stamps recorded at time intervals during a first thermal cycling process and a time stamp for each time interval, and a second time/temperature data set includes temperatures and time stamps recorded at time intervals during a second thermal cycling process. Signal emissions at different signal detecting positions are sequentially measured at different time intervals to generate first and second time/signal emission data sets for receptacles subject to the first and second thermal cycling processes, respectively. Signal emissions of receptacles subject to the first thermal cycling process are synchronized with specific temperatures of the first thermal cycling process by comparing time stamps of the first time/signal emission data set for each receptacle with the time stamps of the first time/temperature data set that correspond with the specific temperature. Signal emissions of receptacles subject to the second thermal cycling process are synchronized with specific temperatures of the second thermal cycling process by comparing time stamps of the second time/signal emission data set for each receptacle with the time stamps of the second time/temperature data set that correspond with the specific temperature.
摘要:
An optical regroup cable is provided for a fixed optical cross connect. The cable may include holders for supporting the fibers within the cable and to group the fibers into two bundles. The bundles are arranged so that relative positions of two bundle ends at a first end of the cable are different from relative positions of two bundle ends at a second end of the cable.
摘要:
The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.
摘要:
The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.
摘要:
Optical interconnection methods for high-speed data-rate optical transport systems are disclosed that optically interconnect active assemblies to a fiber optic cable in a polarization-preserving manner. The methods include defining active-assembly-wise connector ports that connect to active assembly transmit and receive ports, and defining or establishing a pairings method between the active-assembly-wise connector ports. In a first optical interconnection assembly, an active-assembly-wise port is optically connected to a cable-wise port. In the second optical interconnection assembly, the cable-wise port that corresponds to the connected cable-wise port in the first optical interconnection assembly is optically connected to a select active-assembly-wise port as defined by the pairings method. The optical connection process is then repeated from the second to the first optical interconnection assembly. The optical interconnection acts are repeated until all of the active-assembly-wise ports are connected.
摘要:
A photon emitting device comprises a plurality of solid state radiation sources to generate radiation. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. A support structure is provided to stabilize the plurality of optical waveguides between the first and second ends. The photon emitting device can provide a replacement for a discharge lamp device in various applications including road illumination, spot lighting, back lighting, image projection and radiation activated curing.
摘要:
An optical module including a substrate, a plurality of optical components mounted on the substrate, and a plurality of first optical fibers connected to the optical components. The optical module further includes a fiber sheet including a first resin sheet having an adhesive layer on one side, a plurality of second optical fibers wired on the adhesive layer of the first resin sheet, and a second resin sheet attached to the first resin sheet so that the second optical fibers are sandwiched between the first and second resin sheets. The second optical fibers of the fiber sheet project from between the first and second resin sheets and are connected to the first optical fibers by fusion splicing.
摘要:
An optical circuit is provided having a plurality of legs, each of which may have one or more optical fibers bound together by a matrix material, arranged in a stacked configuration in such a manner as to reduce, if not eliminate, the stress to which the optical fibers are subjected. The optical circuit includes a main body having a flexible substrate and a plurality of optical fibers mounted upon the substrate and lying in a common plane. The plurality of legs extend outwardly from an edge of the main body. The legs are disposed in a stacked configuration in which at least one leg overlies another leg. As such, at least one leg lies at least partially outside of the common plane defined by the substrate. A method for fabricating the optical circuit is also provided.
摘要:
The remote sensing apparatus and method include optical fibers and detectors. One end of the optical fibers is located in a focal plane of an optical system, with the end of each optical fiber collecting spectral energy arriving at a particular location in the focal plane. Each detector is coupled to the other end of a single optical fiber, and the detector measures the intensity of the spectral energy emitted by the optical fiber. Sets of detectors may also be utilized, such that each set of detectors is optically coupled to a respective fiber, and at least one separation element separates the spectral energy emitted by each optical fiber into a plurality of spectral bands. Each detector in each set of detectors then receives a respective spectral band emitted by a respective optical fiber.
摘要:
A three dimensional optical circuit featuring an optical manifold for organizing, guiding and protecting individual optical fibers is shown. One aspect of the present invention is a three dimensional manifold which may be constructed using a rapid prototyping process such as, but not limited to, stereolithography (nullSLAnull), fused deposition modeling (nullFDMnull), selective laser sintering (nullSLSnull), and the like. The manifold has a number of input openings in a first ordered arrangement at one end connected by passageways to a number of output openings in a second ordered arrangement at the opposite end. A plurality of optical fibers may be directed through the passageways of the manifold to produce a three dimensional optical circuit such as a shuffle. Moreover, the optical manifold may be used in conjunction with a number of connections or terminations to form a various optical modules. These modules may be configured for rack mounting within enclosures for electrical components.