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    Microtomic System and Process Utilizing Electrostatic Force to Handle Sample Sections
    4.
    发明申请
    Microtomic System and Process Utilizing Electrostatic Force to Handle Sample Sections 有权
    透视系统和利用静电力处理样品部分的工艺

    公开(公告)号：US20160320270A1

    公开(公告)日：2016-11-03

    申请号：US15208940

    申请日：2016-07-13

    申请人： Focus e-Beam Technology (Beijing) Co., Ltd.

    发明人： Zhongwei Chen

    IPC分类号： G01N1/06 ,  B26D7/18 ,  G01N1/28

    CPC分类号： G01N1/06 ,  B26D7/1845 ,  G01N1/286 ,  G01N2001/061 ,  G01N2001/063 ,  G01N2001/066 ,  G01N2001/2873 ,  Y10T83/0448 ,  Y10T83/0453 ,  Y10T83/2066 ,  Y10T83/2096

    摘要： Provided is a process of using a microtomic system for the preparation of sections for microscope examination. A cutting edge in the system can cut through a sample block and produce a section one end of which remains attached to the cutting edge. A voltage generator can generate a voltage and apply the voltage between the cutting edge and a section receiver such as a semiconductor chip grid. Through electrostatic force caused by the voltage, another end of the section can anchor to the section receiver. The section is then spread on the receiver. The system is automatable, highly efficient, and does not need liquid to float sample sections, and can therefore maintain the integration of the sample sections.

    摘要翻译： 提供了使用显微镜系统来制备用于显微镜检查的切片的过程。 系统中的切割边缘可以切割出样品块，并产生其一端保持附着到切割边缘的部分。 电压发生器可以产生电压并且在切割边缘和诸如半导体芯片格栅之类的部分接收器之间施加电压。 通过由电压引起的静电力，该部分的另一端可以锚定到部分接收器。 然后将该部分扩展到接收器。 该系统是可自动化，高效率的，并且不需要液体漂浮样品部分，因此可以保持样品部分的集成。

    Microtomic system and process utilizing electrostatic force to handle sample sections
    5.
    发明授权
    Microtomic system and process utilizing electrostatic force to handle sample sections 有权
    透视系统和利用静电力处理样品部分的工艺

    公开(公告)号：US09464967B2

    公开(公告)日：2016-10-11

    申请号：US14284328

    申请日：2014-05-21

    申请人： Zhongwei Chen

    发明人： Zhongwei Chen

    IPC分类号： G01N1/06 ,  G01N1/28 ,  B26D7/18

    CPC分类号： G01N1/06 ,  B26D7/1845 ,  G01N1/286 ,  G01N2001/061 ,  G01N2001/063 ,  G01N2001/066 ,  G01N2001/2873 ,  Y10T83/0448 ,  Y10T83/0453 ,  Y10T83/2066 ,  Y10T83/2096

    摘要： Provided is a microtomic system and process for the preparation of sections for microscope examination. A cutting edge in the system can cut through a sample block and produce a section one end of which remains attached to the cutting edge. A voltage generator can generate a voltage and apply the voltage between the cutting edge and a section receiver such as a semiconductor chip grid. Through electrostatic force caused by the voltage, another end of the section can anchor to the section receiver. The section is then spread on the receiver. The system is automatable, highly efficient, and does not need liquid to float sample sections, and can therefore maintain the integration of the sample sections.

    摘要翻译： 提供了用于制备用于显微镜检查的切片的显微镜系统和方法。 系统中的切割边缘可以切割出样品块，并产生其一端保持连接到切割边缘的部分。 电压发生器可以产生电压并且在切割边缘和诸如半导体芯片格栅之类的部分接收器之间施加电压。 通过由电压引起的静电力，该部分的另一端可以锚定到部分接收器。 然后将该部分扩展到接收器。 该系统是可自动化的，高效率的，并且不需要液体漂浮样品部分，因此可以保持样品部分的整合。

    DEVICE FOR SPLITTING FOAM BODIES
    6.
    发明申请
    DEVICE FOR SPLITTING FOAM BODIES 审中-公开
    用于分割泡沫体的装置

    公开(公告)号：US20120247290A1

    公开(公告)日：2012-10-04

    申请号：US13515831

    申请日：2010-12-20

    申请人： Norbert Leyens ,  Stefan Lennartz

    发明人： Norbert Leyens ,  Stefan Lennartz

    IPC分类号： B26D7/32 ,  B26D3/28 ,  B26D1/46

    CPC分类号： B26D3/28 ,  B26D3/281 ,  B26D7/1845 ,  Y10T83/0448 ,  Y10T83/2092 ,  Y10T83/2192

    摘要： A thin layer is cut from a foam material body using a band-knife. A take-off device that lifts and removes the layer from the cutting site, comprises a belt conveyor with an electrostatically chargeable conveyor element. The layer is lifted and removed from the cutting site by electrostatic attraction to the conveyor element.

    摘要翻译： 使用带刀从泡沫材料体切割薄层。 从切割部位提升和去除层的起飞装置包括具有静电带电输送机元件的带式输送机。 该层通过静电吸引到输送机元件而从切割位置被提升和移除。

    Punching apparatus
    7.
    发明申请
    Punching apparatus 有权
    冲孔机

    公开(公告)号：US20070295178A1

    公开(公告)日：2007-12-27

    申请号：US11812130

    申请日：2007-06-15

    申请人： Masaru Tsuji ,  Jinichi Nagata ,  Hideo Yoshikawa ,  Hidetoshi Kaneko ,  Kouzou Yamaguchi ,  Masayuki Nagatani

    发明人： Masaru Tsuji ,  Jinichi Nagata ,  Hideo Yoshikawa ,  Hidetoshi Kaneko ,  Kouzou Yamaguchi ,  Masayuki Nagatani

    IPC分类号： B26F1/14

    CPC分类号： B26F1/0092 ,  B26D5/14 ,  B26D7/18 ,  B26D7/1845 ,  B26D2007/0018 ,  B26F1/24 ,  Y10T83/2218 ,  Y10T83/222 ,  Y10T83/9423 ,  Y10T83/9428

    摘要： In one embodiment, a charge removal member 120, which removes static electricity built up on paper waste 130, is disposed in a collecting container 63 used for collecting the punch waste 130 generated by punching transported paper. The charge removal member 120 is disposed in an open top portion of the collecting container 63, in a location corresponding to a hole-punching punch 64 disposed in the punching unit 60, with a proximal end portion 121 of the charge removal member 120 supported by the collecting container 63 and the distal end portion of the charge removal member 120 forming charge removal comb-shaped needles 122 extending towards the central portion of the collecting container.

    摘要翻译： 在一个实施例中，除去堆放在纸废物130上的静电的电荷去除构件120设置在用于收集通过冲压输送的纸而产生的冲压废料130的收集容器63中。 电荷去除构件120设置在收集容器63的敞开的顶部中，位于与设置在冲孔单元60中的穿孔冲头64相对应的位置，电荷去除构件120的近端部分121由 收集容器63和电荷去除构件120的远端部分形成朝向收集容器的中心部分延伸的去除梳状针122。

    SUBSTRATE CUTTING SYSTEM
    10.
    发明申请
    SUBSTRATE CUTTING SYSTEM 审中-公开
    基板切割系统

    公开(公告)号：US20170036367A1

    公开(公告)日：2017-02-09

    申请号：US15137337

    申请日：2016-04-25

    申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

    发明人： Junneng DENG ,  Tao DENG ,  Minjiang FAN ,  Hongyi LI

    IPC分类号： B26D7/18 ,  B01D21/26 ,  C03B33/023 ,  B26D7/01 ,  B26D5/00

    CPC分类号： B26D7/1845 ,  B01D21/267 ,  B26D5/007 ,  B26D7/018 ,  B26D7/088 ,  B28D7/02

    摘要： A substrate cutting system is provided. The substrate cutting system includes a cutting tank, an object stage, a cutter assembly, an injection pump and a drain pump; the injection pump is configured to inject water into the cutting tank, and the drain pump is configured to draw water out from the cutting tank. A flowable water environment is formed in the cutting tank by an action of the injection pump and the drain pump. The object stage is a movable base configured to transport a substrate to be cut to the water environment in the cutting tank. The cutter assembly is configured to cut the substrate.

    摘要翻译： 提供了基板切割系统。 基板切割系统包括切割槽，物体台，切割器组件，注射泵和排水泵; 注射泵构造成将水注入切割槽中，并且排水泵构造成从切割槽中抽出水。 通过喷射泵和排水泵的作用在切割槽中形成可流动的水环境。 物体台是可移动基座，其构造成将要切割的基板输送到切割槽中的水环境。 切割器组件被构造成切割基底。