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公开(公告)号：US20150208539A1
公开(公告)日：2015-07-23
申请号：US14424511
申请日：2013-08-27
申请人： MB-Microtec AG
IPC分类号： H05K5/06 , H05K5/03 , A61B1/04 , C03B33/08 , C03B23/217 , C03B33/085 , G03B17/08 , C03B23/24
CPC分类号： H05K5/065 , A61B1/0002 , A61B1/04 , A61B1/041 , A61B1/0661 , A61B5/076 , A61B5/14503 , A61B5/6861 , A61B10/04 , A61B2562/12 , A61B2562/162 , B23K5/006 , B23K5/06 , B23K5/14 , B23K26/0624 , B23K26/0846 , B23K26/206 , B23K26/324 , B23K2101/04 , B23K2101/42 , B23K2103/54 , C03B23/207 , C03B23/217 , C03B23/245 , C03B33/082 , C03B33/0855 , G03B17/08 , H01L21/52 , H01L23/08 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H02J50/00 , H05K5/0095 , H05K5/03 , H05K5/066
摘要： A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
摘要翻译： 一种方法产生具有用于电子部件的至少一个气密密封的容纳空间的壳体，该容纳空间包括壳体内部的至少一部分。 在该方法中，制造/设置由玻璃制成的具有至少一个开口的中空体，至少一个电子装置通过至少一个开口引入，并且容纳空间通过熔化壳体而被气密密封，或者在 至少一个开口被激光辐射密封。 装置具有由硅制成的至少部分密封的壳体，特别是根据上述方法制造的壳体。
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公开(公告)号：US20170118856A1
公开(公告)日：2017-04-27
申请号：US15398317
申请日：2017-01-04
申请人： MB-Microtec AG
IPC分类号： H05K5/06 , H01L27/146 , H02J50/00 , A61B1/04 , A61B5/00 , A61B5/07 , A61B1/06 , A61B5/145 , A61B10/04 , H05K5/03 , A61B1/00
CPC分类号： H05K5/065 , A61B1/0002 , A61B1/04 , A61B1/041 , A61B1/0661 , A61B5/076 , A61B5/14503 , A61B5/6861 , A61B10/04 , A61B2562/12 , A61B2562/162 , B23K5/006 , B23K5/06 , B23K5/14 , B23K26/0624 , B23K26/0846 , B23K26/206 , B23K26/324 , B23K2101/04 , B23K2101/42 , B23K2103/54 , C03B23/207 , C03B23/217 , C03B23/245 , C03B33/082 , C03B33/0855 , G03B17/08 , H01L21/52 , H01L23/08 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H02J50/00 , H05K5/0095 , H05K5/03 , H05K5/066
摘要： A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
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公开(公告)号：US09572273B2
公开(公告)日：2017-02-14
申请号：US14424511
申请日：2013-08-27
申请人： MB-Microtec AG
IPC分类号： H01L21/52 , B23K26/21 , H05K5/06 , H01L23/08 , H05K5/00 , A61B1/04 , C03B23/217 , C03B23/24 , C03B33/08 , C03B33/085 , G03B17/08 , H05K5/03
CPC分类号： H05K5/065 , A61B1/0002 , A61B1/04 , A61B1/041 , A61B1/0661 , A61B5/076 , A61B5/14503 , A61B5/6861 , A61B10/04 , A61B2562/12 , A61B2562/162 , B23K5/006 , B23K5/06 , B23K5/14 , B23K26/0624 , B23K26/0846 , B23K26/206 , B23K26/324 , B23K2101/04 , B23K2101/42 , B23K2103/54 , C03B23/207 , C03B23/217 , C03B23/245 , C03B33/082 , C03B33/0855 , G03B17/08 , H01L21/52 , H01L23/08 , H01L27/14618 , H01L27/14634 , H01L27/1469 , H02J50/00 , H05K5/0095 , H05K5/03 , H05K5/066
摘要： A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
摘要翻译： 一种方法产生具有用于电子部件的至少一个气密密封的容纳空间的壳体，该容纳空间包括壳体内部的至少一部分。 在该方法中，制造/设置由玻璃制成的具有至少一个开口的中空体，至少一个电子装置通过至少一个开口引入，并且容纳空间通过熔化壳体而被气密密封，或者在 至少一个开口被激光辐射密封。 装置具有由硅制成的至少部分密封的壳体，特别是根据上述方法制造的壳体。
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