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公开(公告)号：US20250013148A1
公开(公告)日：2025-01-09
申请号：US18691733
申请日：2022-09-20
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Takuya Uehara , KhanhTin Nguyen , Takuya Ikeda
IPC: G03F7/004 , C07C309/12 , G03F7/00 , G03F7/039 , G03F7/30
Abstract: A resist composition including a base material component and a compound represented by General Formula (b0), in which Rb0 represents a fused cyclic group in which an aromatic ring and an alicyclic ring are fused, the alicyclic ring in the fused cyclic group has substituents, at least one of the substituents contains a hydrocarbon group having a bromine atom or an iodine atom, Yb0 represents a divalent linking group or a single bond, Yb0 is bonded to the alicyclic ring in the fused cyclic group, Vb0 represents a single bond, an alkylene group, or a fluorinated alkylene group, R0 represents a fluorinated alkyl group having 1 to 5 carbon atoms or a fluorine atom, Mm+ represents an m-valent organic cation, and m represents an integer of 1 or greater
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公开(公告)号：US12187943B2
公开(公告)日：2025-01-07
申请号：US17574974
申请日：2022-01-13
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Yukihisa Wada , Shinya Koga , Kazuhiro Takahashi
Abstract: A chemical solution used for cleaning or etching a ruthenium-containing layer, which can obtain the ruthenium-containing layer having a reduced surface roughness while maintaining a good etching rate against the ruthenium, and a method for fabricating ruthenium wiring. The chemical solution includes orthoperiodic acid, a base component, and any one of a nitrogen-containing heterocyclic compound, an organic phosphonic acid, and an organic carboxylic acid.
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公开(公告)号：US12186715B2
公开(公告)日：2025-01-07
申请号：US17611412
申请日：2020-05-20
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Akihiko Nakata , Miku Abe , Hiroki Saito
Abstract: There is provided a production method for a resist composition purified product, which includes a step (i) of filtering a resist composition with a filter having a porous structure in which adjacent spherical cells are connected to each other. The filter includes a porous membrane containing at least one resin selected from the group consisting of polyimide and polyamide imide. The resist composition contains a base material component (A) that exhibits changed solubility in a developing solution under action of acid, an onium salt, and an organic solvent component (S), where the content of the organic solvent component (S) is 97% by mass or more.
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公开(公告)号：US12180317B2
公开(公告)日：2024-12-31
申请号：US17678350
申请日：2022-02-23
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Takahiro Senzaki
IPC: C09D147/00 , C08F236/20
Abstract: To provide a polymerizable composition capable of forming a thick hydrophilic resin coating having high hardness and excellent durability on the surface of an object to be treated, which is a surface treatment object, and a hydrophilizing treatment method in which the polymerizable composition is used. In a polymerizable composition including a polymerizable compound (A), a polymerization initiator (B), inorganic fine particles (C) and a solvent (S), a polymerizable betaine compound (A1) having an ethylenic unsaturated double bond and a betaine structure and an adhesive polymerizable compound (A2) having an ethylenic unsaturated double bond and a specific type of adhesive group are used as the polymerizable compound (A); a water-soluble radical polymerization initiator (B1) is used as the polymerization initiator (B); and inorganic fine particles (C) having a functional group capable of forming a covalent bond with a polymer of the polymerizable compound (A) are used.
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公开(公告)号：US20240427244A1
公开(公告)日：2024-12-26
申请号：US18700987
申请日：2022-11-01
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Yasuo SOMEYA , Takaaki KAIHO
Abstract: A resist composition containing a base component, an acid generator component, and an acid diffusion-controlling agent. The acid generator component includes a compound having a molar absorption coefficient of 50,000 mol−1·L·cm−1 or less at an exposure wavelength of 193 nm, and the acid diffusion-controlling agent includes a compound represented by General Formula (d0), in which Rd01 represents a cyclic group or a chain alkenyl group which may have a substituent, Yd01 represents a divalent linking group containing an oxygen atom, m represents an integer of 1 or more, and Mm+ represents an m-valent organic cation Rd01-Yd01-CH2—SO3⊖(Mm⊕)1/m (d0)
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Patent Agency Ranking
公开(公告)号：US20240425440A1
公开(公告)日：2024-12-26
申请号：US18697720
申请日：2022-10-20
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Rin Odashima , Hiroki Kato
Abstract: A method for producing an acid generator including reacting a carboxylic acid represented by Formula (d0-1) having a pKa of 0.50 or more with at least one of a nitrogen-containing base compound and an onium compound to obtain an intermediate represented by Formula (d0-p), and subjecting the intermediate (d0-p) to an ion exchange reaction with a compound represented by Formula (c0) to obtain a compound represented by Formula (d0). In the formulae, X0 represents a bromine atom or an iodine atom, Rm represents a hydroxy group, nb1 represents an integer in a range of 1 to 5, 1≤nb1+nb2≤5 is satisfied, Yd represents a divalent linking group or a single bond, Mpm′+ represents an organic ammonium cation having a logPOW of 4.8 or less or an onium cation having a logPOW of 4.8 or less, X− represents a counter anion, and Mm+ represents an onium cation.
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公开(公告)号：US20240409812A1
公开(公告)日：2024-12-12
申请号：US18732471
申请日：2024-06-03
Applicant: Tokyo Ohka Kogyo Co., Ltd.
Inventor： Takahiro Eto
Abstract: A treatment liquid containing a fluorine-containing compound, an organic solvent, a basic compound represented by General Formula NR1R2R3, and water, in which a content of the organic solvent is 65% by mass or more with respect to a total amount of the treatment liquid, and a pH is 6 to 9. In the formula, R1 to R3 are each independently a hydrogen atom or a hydrocarbon group which may have a substituent.
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公开(公告)号：US20240384056A1
公开(公告)日：2024-11-21
申请号：US18694174
申请日：2022-08-18
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Ryutaro SUGAWARA , Takuro ASABA
IPC: C08K3/08 , C07C319/14 , C07C319/20 , C07C323/19 , C07C323/20 , C08F122/24 , C08K3/22
Abstract: A photosensitive composition which tends to hardly occur excessive decrease of weight of a component (in which is a component other than a solvent, when the composition or the photosensitive composition includes the solvent) in the composition or the photosensitive composition by heating, and include inorganic microparticles in a stably dispersed state, a cured product of the photosensitive composition, a compound which can be preferably added to the composition and the photosensitive composition, and a production method of the compound are provided. In a composition including a photopolymerizable compound (A) and inorganic microparticles (B) or a photosensitive composition including a photopolymerizable compound (A), inorganic microparticles (B), and an initiator, a compound with a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group is used as the photopolymerizable compound (A).
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公开(公告)号：US12129335B2
公开(公告)日：2024-10-29
申请号：US17457107
申请日：2021-12-01
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Ryutaro Sugawara
IPC: C08G61/12 , C07D251/70
CPC classification number: C08G61/122 , C07D251/70
Abstract: A curable composition that gives a cured product exhibiting a high refractive index and a surface without defects such as roughness or cracks, a cured product of the composition, and a compound that may be blended to the composition. In a curable composition including a triazine compound having three aromatic-ring-containing groups each bonded to the triazine ring via an amino group, an aromatic-ring-containing group having a specific structure having a radically polymerizable group-containing group or a cationically polymerizable group-containing group is used as at least one of the three aromatic-ring-containing groups bonded to the triazine ring in the triazine compound mentioned above.
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10.发明公开公开(公告)号：US20240336882A1
公开(公告)日：2024-10-10
申请号：US18681554
申请日：2022-08-25
Applicant: TOKYO OHKA KOGYO CO., LTD.
Inventor： Takashi KAMIZONO , Takashi FUJIMOTO , Takafumi AKABANE , Taku SATOH , Hiroyuki MORIGUCHI
Abstract: A chip for cell culture, including a laminate having a flow path structure inside, in which respective members constituting respective layers of the laminate are adhered by adhesive layers, and the adhesive layer includes a first adhesive layer formed of an adhesive that contains a polyester-based resin having a glass transition temperature of 37° C. or higher and 120° C. or lower.
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